Honor X6b vs hotwav T7 Pro

At a glance

Brand: Honor; Hotwav
Release date: June 2024, 1 years 11 months ago; June 2024, 1 years 11 months ago
AnTuTu: 222.000 Antutu v10 Overall performance better than 56% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Size: 6.56"; 6.6"
Resolution: 720 x 1612 px HD+; 1080 x 2460 px FHD+
Type: TFT LCD (IPS); LCD IPS
Density: 270 ppi Medium Density; 407 ppi Very high density
Aspect ratio: 20:9; 21:9
Features: Water Drop Notch, Max brightness HBM - 500 cd/m², 83% NTSC, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless; Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch

Chipset: MediaTek Helio G85 (MT6769V/CZ); MediaTek MT8788V
CPU: 2x Cortex A75 2.0 GHz + 6x Cortex A55 1.8 GHz; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
CPU type: Octa-Core; Octa-Core
Process: 12 nm; 12 nm
Frequency: 2 GHz; 2 GHz
GPU: Arm Mali-G52 MC2 950MHz; Mali-G72 MP3
RAM: 4 GB; 6 GB
64-bit: Yes; Yes
RAM type: —; LPDDR4X RAM

Resolution: 50 Mpx; 64 Mpx
Aperture: ƒ/ 1.8; Unknow
Flash: LED; LED
Optical stabilization: No; No
Slow motion: Yes, 120 fps; No, 30 fps
Features: Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer, Front Flash; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Dimensions: 75.3 mm 163.6 mm 8.4 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Weight: 192 g; 292 g
Materials: Plastic , Splash resistant design; Rugged Smartphone, Plastic , Faux leather
Colors: Black Purple Green Cyan; Black Orange
Water/dust resistance: IP54; IP68, IP69 , MIL-STD-810H
Usable surface: 83 %; 71 %
Drop resistance: —; Class A B C D E 270 drops without defects
Repairability: —; Class A B C D E

Operating system: Android 14 Upside-down cake Android 14; Android 13 Tiramisu Android 13
Updates: OS updates: 2 years, Security updates: 3 years; —
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1 LELow energy consumption; Bluetooth 5.0 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), LE (Low Energy), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)