Honor X6b Plus vs Xiaomi Redmi 13

At a glance

Brand: Honor; Xiaomi
Release date: November 2024, 1 years 6 months ago; May 2024, 2 years ago
AnTuTu: 222.000 Antutu v10 Overall performance better than 56% of devices; 269.266 Antutu v10 Overall performance better than 60% of devices

Size: 6.56"; 6.79"
Resolution: 720 x 1612 px HD+; 1080 x 2400 px FHD+
Type: TFT LCD (IPS); LTPS LCD
Density: 270 ppi Medium Density; 388 ppi High Density
Aspect ratio: 20:9; 19.5:9
Features: Water Drop Notch, Max brightness HBM - 500 cd/m², 83% NTSC, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless; Hole-punch Notch, SGS Certified, Refresh rate 90 Hz, Scratch resistant, 2.5D curved glass glass, Capacitive, Multi-touch, Frameless

Chipset: MediaTek Helio G85 (MT6769V/CZ); MediaTek Helio G91
CPU: 2x Cortex A75 2.0 GHz + 6x Cortex A55 1.8 GHz; 2x Cortex A75 2.0 GHz + 6x Cortex A55 1.8 GHz
CPU type: Octa-Core; Octa-Core
Process: 12 nm; 12 nm
Frequency: 2 GHz; 2 GHz
GPU: Arm Mali-G52 MC2 950MHz; Arm Mali-G52 MC2 850MHz
RAM: 4 GB; 6 GB
64-bit: Yes; Yes

Resolution: 50 Mpx; 108 Mpx
Aperture: ƒ/ 1.8; ƒ/ 1.8
Flash: LED; Quad LED
Optical stabilization: No; No
Slow motion: Yes, 120 fps; Yes, 120 fps
Features: Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer, Front Flash; Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Dimensions: 75.3 mm 163.6 mm 8.4 mm Print 3D Model; 76.3 mm 168.6 mm 8.2 mm Print 3D Model
Weight: 192 g; 198 g
Materials: Plastic , Splash resistant design; Plastic , P2i Nano coating , Splash resistant design
Colors: Black Purple Green Cyan; Black Pink Cyan
Water/dust resistance: IP54; —
Usable surface: 83 %; 94 %

Operating system: Android 14 Upside-down cake Android 14; Android 14 Upside-down cake HyperOS (Android 14)
Updates: OS updates: 2 years, Security updates: 3 years; —
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1 LELow energy consumption; Bluetooth 5.4 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), LE (Low Energy), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), LE (Low Energy), APT-x
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)