Honor X50 vs iiif150 B3C

At a glance

Brand: Honor; iiiF150
Release date: July 2023, 2 years 11 months ago; April 2025, 1 years 2 months ago
AnTuTu: 578.810 Antutu v10 Overall performance better than 75% of devices; 251.000 Antutu v10 Overall performance better than 59% of devices

Size: 6.78"; 6.6"
Resolution: 1080 x 2652 px FHD+; 720 x 1600 px HD+
Type: AMOLED; LCD IPS
Density: 422 ppi Very high density; 266 ppi Medium Density
Aspect ratio: 21:9; 20:9
Features: Hole-punch Notch, SGS Certified, 1920 Hz PWM, Refresh rate 120 Hz, Peak brightness - 1200 cd/m², DCI-P3, 10 Bits panel, Scratch resistant, Dual Edge display, Stylus, Capacitive, Multi-touch, Frameless; Hole-punch Notch, Refresh rate 90 Hz, Color LED Notifications, Corning Gorilla Glass 3, Capacitive, Multi-touch

Resolution: 108 Mpx; 50 Mpx
Aperture: ƒ/ 1.75; Unknow
Sensor: Samsung HM6; —
Pixel size: 1.00 µm; —
Sensor size: 1/1.67"; —
Flash: Dual LED; Triple LED
Optical stabilization: No; No
Slow motion: Yes, 240 fps; No, 30 fps
Features: 4K Video, Digital zoom, Dual camera, Digital image stabilization, Ultra stable video, Autofocus, Touch focus, Continuous autofocus, Manual focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer, RAW, Night Mode; Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Dimensions: 75.5 mm 163.6 mm 8.0 mm Print 3D Model; 79.6 mm 168.8 mm 15.8 mm Print 3D Model
Weight: 185 g; 336 g
Materials: Plastic , Splash resistant design; TPU , Rugged Smartphone, Polycarbonate , Metal
Colors: Black Silver Orange Cyan; Black Gray
Water/dust resistance: IP53; IP68, IP69 , MIL-STD-810H
Usable surface: 83 %; 78 %
Drop resistance: —; Class A B C D E 270 drops without defects
Repairability: —; Class A B C D E

Operating system: Android 13 Tiramisu Android 13; Android 14 Upside-down cake Android 14
Google services: Without Google Mobile services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1 LELow energy consumption; Bluetooth 5.0
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), LE (Low Energy), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac, WiFi 6 (802.11ax); 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, GPS (L1+L5), Galileo (E1+E5a); GPS, A-GPS, GLONASS, Beidou

5G: n1 (2100), n5 (850), n7 (2600), n8 (900), n28a (700), n38 (2600), n40 (2300), n41 (2500), n78 (3500); —
4G LTE: B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: CDMA BC10 (800 Secondary), B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), B2 (1900), B3 (1800), B5 (850), B8 (900)