Honor X5 vs hotwav Cyber 13 Pro

At a glance

Brand: Honor; Hotwav
Release date: January 2023, 3 years 4 months ago; October 2023, 2 years 7 months ago
AnTuTu: 97.899 Antutu v9 Overall performance better than 50% of devices; 285.000 Antutu v9 Overall performance better than 61% of devices

Size: 6.5"; 6.6"
Resolution: 720 x 1600 px HD+; 1080 x 2408 px FHD+
Type: TFT LCD (IPS); LCD IPS
Density: 270 ppi Medium Density; 396 ppi High Density
Aspect ratio: 20:9; 21:9
Features: Water Drop Notch, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless; Hole-punch Notch, Refresh rate 90 Hz, 1500:1 contrast ratio, Corning Gorilla Glass, Capacitive, Multi-touch

Chipset: Mediatek Helio G25; Unisoc Tiger T619
CPU: 8x Cortex A53 2.0 GHz; 2 x ARM Cortex A75 2.2Ghz + 6 x ARM Cortex A55 1.8Ghz
CPU type: Octa-Core; Octa-Core
Process: 12 nm; 12 nm
Frequency: 2 GHz; 2 GHz
GPU: IMG PowerVR GE8320 600MHz; GPU ARM Mali-G57
RAM: 2 GB; 12 GB
64-bit: Yes; Yes
RAM type: —; LPDDR4X RAM

Resolution: 8 Mpx; 64 Mpx
Aperture: ƒ/ 2.0; Unknow
Flash: LED; Dual LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Digital zoom, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Contrast detection autofocus (CDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacity: 32 GB; 256 GB
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 75.6 mm 164.0 mm 8.9 mm Print 3D Model; 84.2 mm 176.8 mm 16.8 mm Print 3D Model
Weight: 193 g; 380 g
Materials: Plastic; TPU , Rugged Smartphone
Colors: Black Blue Orange; Black
Usable surface: 82 %; 70 %
Water/dust resistance: —; IP68, MIL-STD-810G , IP69
Drop resistance: —; Class A B C D E 270 drops without defects
Repairability: —; Class A B C D E

Operating system: Android 12 Snow Cone Android 12 Go edition; Android 13 Tiramisu Android 13
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1 LELow energy consumption; Bluetooth 5.3
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), LE (Low Energy); A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou
USB: —; USB Type-C

4G LTE: B1 (2100), B3 (1800), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B8 (900), B26 (850); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)