Honor Play 50 Plus vs hotwav T7

At a glance

Brand: Honor; Hotwav
Release date: October 2023, 2 years 8 months ago; July 2024, 1 years 11 months ago
AnTuTu: 394.400 Antutu v10 Overall performance better than 65% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Size: 6.8"; 6.6"
Resolution: 1080 x 2412 px FHD+; 1080 x 2460 px FHD+
Type: TFT LCD (IPS); LCD IPS
Density: 389 ppi High Density; 407 ppi Very high density
Aspect ratio: 20:9; 21:9
Features: Hole-punch Notch, 850 cd/m² maximum brightness, Refresh rate 90 Hz, Scratch resistant, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless; Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch

Chipset: MediaTek Dimensity 6020 (MT6833V/ZA); MediaTek MT8788V
CPU: 2x2.2 GHz ARM Cortex A76 + 6x2.0 GHz ARM Cortex A55; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
CPU type: Octa-Core; Octa-Core
Process: 7 nm; 12 nm
Frequency: 2.2 GHz; 2 GHz
GPU: ARM Mali-G57; Mali-G72 MP3
RAM: 12 GB; 4 GB
RAM type: LPDDR4X RAM; LPDDR4X RAM
64-bit: Yes; Yes

Resolution: 50 Mpx; 21 Mpx
Aperture: ƒ/ 1.8; Unknow
Flash: LED; LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Sony Exmor

Capacity: 256 GB; 128 GB
Type: UFS Storage; eMMC 5.1 Storage
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 76.5 mm 166.7 mm 8.2 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Weight: 199 g; 292 g
Materials: Plastic; Rugged Smartphone, Plastic , Faux leather
Colors: Black Green Cyan Purple Ish; Black Orange
Usable surface: 87 %; 71 %
Water/dust resistance: —; IP68, IP69 , MIL-STD-810H

Operating system: Android 13 Tiramisu Android 13; Android 13 Tiramisu Android 13
Google services: Without Google Mobile services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.0 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B8 (900), B12 (700), B17 (700), B18 (800), B19 (800), B20 (800), B26 (850), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: CDMA BC0 (800), B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)