hmd Fusion vs hotwav Note 13

At a glance

Brand: HMD; Hotwav
Release date: September 2024, 1 years 8 months ago; April 2024, 2 years 1 months ago
AnTuTu: 456.552 Antutu v10 Overall performance better than 72% of devices; 235.000 Antutu v10 Overall performance better than 57% of devices

Size: 6.56"; 6.6"
Resolution: 720 x 1612 px HD+; 720 x 1612 px HD+
Type: LCD IPS; LCD IPS
Density: 269 ppi Medium Density; 267 ppi Medium Density
Aspect ratio: 20:9; 20:9
Features: Hole-punch Notch, Refresh rate 90 Hz, Peak brightness - 600 cd/m², Brightnes 480 cd/m² (typ), Scratch resistant, 2.5D curved glass screen, Capacitive, Frameless; Water Drop Notch, Max brightness HBM - 500 cd/m², 2.5D curved glass screen, Capacitive, Multi-touch

Chipset: Qualcomm Snapdragon 4 Gen 2 (SM4450); Unisoc Tiger T606
CPU: 2x2.2 GHz Cortex A76 +6x 2.0 GHz Cortex A55; 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55
CPU type: Octa-Core; Octa-Core
Process: 4 nm; 12 nm
Frequency: 2.2 GHz; 1.6 GHz
GPU: Qualcomm Adreno; ARM Mali-G57
RAM: 6 GB; 4 GB
RAM type: LPDDR4X RAM; LPDDR4X RAM
64-bit: Yes; Yes

Resolution: 108 Mpx; 50 Mpx
Aperture: Unknow; ƒ/ 1.8
Flash: LED; LED
Optical stabilization: No; No
Slow motion: Yes, 120 fps; No, 30 fps
Features: Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Omnivision OV50C
Pixel size: —; 0.60 µm
Sensor size: —; 1/2.5"

Capacity: 128 GB; 128 GB
Type: UFS Storage 2.2; UFS Storage 2.1
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 75.5 mm 164.2 mm 8.3 mm Print 3D Model; 76.5 mm 166.2 mm 8.9 mm Print 3D Model
Weight: 203 g; 236 g
Materials: Plastic; Plastic
Colors: Black; Black Blue Violet
Water/dust resistance: IP54; —
Drop resistance: Class A B C D E 270 drops without defects; Class A B C D E 90 drops without defects
Repairability: Class A B C D E; Class A B C D E
Usable surface: 83 %; 82 %

Operating system: Android 14 Upside-down cake Android 14; Android 13 Tiramisu Android 13
Updates: OS updates: 5 years; —
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM / eSIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1 LELow energy consumption; Bluetooth 5.0 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy), APT-x, Apt-x Adaptive; A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

5G: n1 (2100), n3 (1800), n5 (850), n7 (2600), n8 (900), n20 (800), n26 (850), n28b (700), n28a (700), n38 (2600), n40 (2300), n41 (2500), n77 (3700), n78 (3500); —
4G LTE: B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B32 (1500), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)