hmd Aura 2 vs iiif150 B3C

At a glance

Brand: HMD; iiiF150
Release date: February 2025, 1 years 3 months ago; April 2025, 1 years 1 months ago
AnTuTu: 154.110 Antutu v10 Overall performance better than 54% of devices; 251.000 Antutu v10 Overall performance better than 59% of devices

Size: 6.52"; 6.6"
Resolution: 576 x 1280 px LowRes; 720 x 1600 px HD+
Type: LCD IPS; LCD IPS
Density: 215 ppi Medium Density; 266 ppi Medium Density
Aspect ratio: 20:9; 20:9
Features: Water Drop Notch, Brightnes 460 cd/m² (typ), 72% NTSC, Scratch resistant, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless; Hole-punch Notch, Refresh rate 90 Hz, Color LED Notifications, Corning Gorilla Glass 3, Capacitive, Multi-touch

Chipset: Spreadtrum Unisoc SC9863A; Unisoc UMS9230
CPU: 4x Cortex A55 1.6 GHz + 4x Cortex A55 1.2 GHz; 2 x 1.8 GHz & 6 x 1.8 GHz
CPU type: Octa-Core; Octa-Core
Process: 28 nm; 12 nm
Frequency: 1.6 GHz; 1.8 GHz
GPU: PowerVR GE8322; Mali G57 MP1
RAM: 4 GB; 4 GB
RAM type: LPDDR4X RAM; LPDDR4X RAM
64-bit: Yes; Yes

Resolution: 13 Mpx; 50 Mpx
Aperture: Unknow; Unknow
Flash: LED; Triple LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Digital zoom, Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacity: 256 GB; 256 GB
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Type: —; UFS Storage 2.2

Dimensions: 76.9 mm 166.4 mm 8.9 mm Print 3D Model; 79.6 mm 168.8 mm 15.8 mm Print 3D Model
Weight: 185 g; 336 g
Materials: Plastic; TPU , Rugged Smartphone, Polycarbonate , Metal
Colors: Black Green; Black Gray
Water/dust resistance: IP54; IP68, IP69 , MIL-STD-810H
Usable surface: 80 %; 78 %
Drop resistance: —; Class A B C D E 270 drops without defects
Repairability: —; Class A B C D E

Operating system: Android 14 Upside-down cake Android 14; Android 14 Upside-down cake Android 14
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.2 LELow energy consumption; Bluetooth 5.0
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11b , 802.11g , 802.11n; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, Galileo; GPS, A-GPS, GLONASS, Beidou
USB: —; USB Type-C

4G LTE: B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), B2 (1900), B3 (1800), B5 (850), B8 (900)