hisense E60 Lite vs iiif150 B2 Ultra

At a glance

Brand: HiSense; iiiF150
Release date: April 2022, 4 years 2 months ago; August 2023, 2 years 10 months ago
AnTuTu: 121.300 Antutu v9 Overall performance better than 52% of devices; 415.300 Antutu v10 Overall performance better than 68% of devices

Size: 6.52"; 6.8"
Resolution: 720 x 1600 px HD+; 1080 x 2460 px FHD+
Type: LCD IPS; LCD IPS
Density: 269 ppi Medium Density; 395 ppi High Density
Aspect ratio: 21:9; 21:9
Features: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, Refresh rate 120 Hz, Color LED Notifications, Corning Gorilla Glass 5, Capacitive, Multi-touch

Chipset: Spreadtrum Unisoc SC9863A; MediaTek Helio G99 (MT6789)
CPU: 4x Cortex A55 1.6 GHz + 4x Cortex A55 1.2 GHz; 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz
CPU type: Octa-Core; Octa-Core
Process: 28 nm; 6 nm
Frequency: 1.6 GHz; 2.2 GHz
GPU: PowerVR GE8322; Mali-G57 MC2
RAM: 2 GB; 12 GB
64-bit: Yes; Yes
RAM type: —; LPDDR4X RAM

Resolution: 13 Mpx; 200 Mpx
Aperture: Unknow; ƒ/ 1.65
Flash: Dual LED; Triple LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Digital zoom, Triple camera, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Samsung ISOCELL HP3
Pixel size: —; 0.56 µm
Sensor size: —; 1/1.4"

Capacity: 64 GB; 256 GB
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Type: —; UFS Storage 2.2

Dimensions: 76.7 mm 166.0 mm 9.7 mm Print 3D Model; 81.8 mm 176.4 mm 19.9 mm Print 3D Model
Weight: 199 g; 465 g
Materials: Plastic; TPU , Rugged Smartphone, Titanium-aluminium alloy
Colors: Blue Gray; Black
Usable surface: 80 %; 74 %
Water/dust resistance: —; IP68, IP69 , MIL-STD-810H

Operating system: Android 11 Red Velvet Cake Android 11 Go edition; Android 15 Android 15
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 4.2; Bluetooth 5.2
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11b , 802.11g , 802.11n , 802.11n 5GHz; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B12 (700), B26 (850), B28b (700), B28a (700); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC10 (800 Secondary), B2 (1900), B3 (1800), B5 (850), B8 (900)