hisense E60 Lite vs hmd ARC

At a glance

Brand: HiSense; HMD
Release date: April 2022, 4 years 2 months ago; December 2024, 1 years 6 months ago
AnTuTu: 121.300 Antutu v9 Overall performance better than 52% of devices; 154.110 Antutu v10 Overall performance better than 54% of devices

Size: 6.52"; 6.52"
Resolution: 720 x 1600 px HD+; 576 x 1280 px LowRes
Type: LCD IPS; LCD IPS
Density: 269 ppi Medium Density; 215 ppi Medium Density
Aspect ratio: 21:9; 20:9
Features: Water Drop Notch, Capacitive, Multi-touch, Frameless; Water Drop Notch, Brightnes 400 cd/m² (typ), 70% NTSC, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless

Chipset: Spreadtrum Unisoc SC9863A; Spreadtrum Unisoc SC9863A
CPU: 4x Cortex A55 1.6 GHz + 4x Cortex A55 1.2 GHz; 4x Cortex A55 1.6 GHz + 4x Cortex A55 1.2 GHz
CPU type: Octa-Core; Octa-Core
Process: 28 nm; 28 nm
Frequency: 1.6 GHz; 1.6 GHz
GPU: PowerVR GE8322; PowerVR GE8322
RAM: 2 GB; 4 GB
64-bit: Yes; Yes

Resolution: 13 Mpx; 13 Mpx
Aperture: Unknow; ƒ/ 2.0
Flash: Dual LED; Dual LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Digital zoom, Triple camera, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Dimensions: 76.7 mm 166.0 mm 9.7 mm Print 3D Model; 76.9 mm 166.4 mm 9.0 mm Print 3D Model
Weight: 199 g; 185 g
Materials: Plastic; Plastic
Colors: Blue Gray; Black
Usable surface: 80 %; 80 %
Water/dust resistance: —; IP54
Drop resistance: —; Class A B C D E 270 drops without defects
Repairability: —; Class A B C D E

Operating system: Android 11 Red Velvet Cake Android 11 Go edition; Android 14 Upside-down cake Android 14
Google services: With Google Mobile Services; With Google Mobile Services
Updates: —; OS updates: 5 years

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 4.2; Bluetooth 5.2
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11b , 802.11g , 802.11n , 802.11n 5GHz; 802.11b , 802.11g , 802.11n
Wi-Fi features: Dual band, Wi-Fi Hotspot; Wi-Fi Hotspot
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B12 (700), B26 (850), B28b (700), B28a (700); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)