hisense A9 Pro vs ZTE Blade A76

At a glance

Brand: HiSense; ZTE
Release date: March 2023, 3 years 3 months ago; June 2025, 1 years ago
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 479.500 Antutu v10 Overall performance better than 72% of devices

Size: 6.1"; 6.75"
Resolution: 824 x 1648 px FHD; 900 x 2030 px FHD
Type: eInk E INK Carta 1200; LCD IPS
Density: 302 ppi High Density; 327 ppi High Density
Aspect ratio: 18:9; 20:9
Features: Water Drop Notch, Capacitive, Multi-touch, Frameless; Water Drop Notch, Refresh rate 90 Hz, Max brightness HBM - 1000 cd/m², 2.5D curved glass screen, Capacitive, Multi-touch, Frameless

Chipset: Qualcomm Snapdragon 662; Unisoc T7520 (Tanggula T760)
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 4x2.0 GHz ARM Cortex A75 + 4x1.8 GHz ARM Cortex A55
CPU type: Octa-Core; Octa-Core
Process: 11 nm; 12 nm
Frequency: 2 GHz; 2 GHz
GPU: Qualcomm Adreno 610; IMG9446
RAM: 8 GB; 4 GB
64-bit: Yes; Yes
RAM type: —; LPDDR4X RAM

Resolution: 13 Mpx; 50 Mpx
Aperture: Unknow; ƒ/ 1.8
Flash: LED; Dual LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; 4K Video, Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer, Dual capture

Dimensions: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 74.8 mm 163.3 mm 8.2 mm Print 3D Model
Weight: 183 g; 203 g
Materials: Plastic; Plastic
Colors: Black; Black Silver
Usable surface: 76 %; 85 %
Water/dust resistance: —; IP54 , IPX4
Drop resistance: —; Class A B C D E 90 drops without defects
Repairability: —; Class A B C D E

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.4 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)
5G: —; n1 (2100), n3 (1800), n5 (850), n7 (2600), n8 (900), n20 (800), n28b (700), n28a (700), n38 (2600), n41 (2500), n77 (3700), n78 (3500)