hisense A9 Pro vs Xiaomi Redmi 13

At a glance

Brand: HiSense; Xiaomi
Release date: March 2023, 3 years 3 months ago; May 2024, 2 years 1 months ago
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 269.266 Antutu v10 Overall performance better than 60% of devices

Size: 6.1"; 6.79"
Resolution: 824 x 1648 px FHD; 1080 x 2400 px FHD+
Type: eInk E INK Carta 1200; LTPS LCD
Density: 302 ppi High Density; 388 ppi High Density
Aspect ratio: 18:9; 19.5:9
Features: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, SGS Certified, Refresh rate 90 Hz, Scratch resistant, 2.5D curved glass glass, Capacitive, Multi-touch, Frameless

Chipset: Qualcomm Snapdragon 662; MediaTek Helio G91
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x Cortex A75 2.0 GHz + 6x Cortex A55 1.8 GHz
CPU type: Octa-Core; Octa-Core
Process: 11 nm; 12 nm
Frequency: 2 GHz; 2 GHz
GPU: Qualcomm Adreno 610; Arm Mali-G52 MC2 850MHz
RAM: 8 GB; 6 GB
64-bit: Yes; Yes

Resolution: 13 Mpx; 108 Mpx
Aperture: Unknow; ƒ/ 1.8
Flash: LED; Quad LED
Optical stabilization: No; No
Slow motion: No, 30 fps; Yes, 120 fps
Features: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacity: 256 GB; 128 GB
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Type: —; eMMC 5.1 Storage

Dimensions: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 76.3 mm 168.6 mm 8.2 mm Print 3D Model
Weight: 183 g; 198 g
Materials: Plastic; Plastic , P2i Nano coating , Splash resistant design
Colors: Black; Black Pink Cyan
Usable surface: 76 %; 94 %

Operating system: Android 12 Snow Cone Android 12; Android 14 Upside-down cake HyperOS (Android 14)
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.4 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), LE (Low Energy), APT-x
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)