hisense A9 Pro vs Xiaomi Redmi 10 IN

At a glance

Brand: HiSense; Xiaomi
Release date: March 2023, 3 years 3 months ago; March 2022, 4 years 3 months ago
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 248.639 Antutu v9 Overall performance better than 58% of devices

Size: 6.1"; 6.7"
Resolution: 824 x 1648 px FHD; 720 x 1600 px HD+
Type: eInk E INK Carta 1200; LCD IPS
Density: 302 ppi High Density; 262 ppi Medium Density
Aspect ratio: 18:9; 20:9
Features: Water Drop Notch, Capacitive, Multi-touch, Frameless; Water Drop Notch, Brightnes 400 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, 2.5D glass screen, Capacitive, Multi-touch, Frameless

Chipset: Qualcomm Snapdragon 662; Qualcomm Snapdragon 680 (SM6225)
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 4x2.4 GHz Kryo 265 Gold + 4x1.9GHz Kryo 265 Silver
CPU type: Octa-Core; Octa-Core
Process: 11 nm; 6 nm
Frequency: 2 GHz; 2.4 GHz
GPU: Qualcomm Adreno 610; Adreno 610
RAM: 8 GB; 4 GB
64-bit: Yes; Yes
RAM type: —; LPDDR4X RAM

Resolution: 13 Mpx; 50 Mpx
Aperture: Unknow; ƒ/ 1.8
Flash: LED; LED
Optical stabilization: No; No
Slow motion: No, 30 fps; Yes, 120 fps
Features: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Geotagging, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Samsung S5KJN1
Pixel size: —; 0.64 µm
Sensor size: —; 1/2.76"

Dimensions: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 76.6 mm 169.6 mm 9.1 mm Print 3D Model
Weight: 183 g; 203 g
Materials: Plastic; Plastic
Colors: Black; Black Blue Green
Usable surface: 76 %; 83 %

Operating system: Android 12 Snow Cone Android 12; Android 11 Red Velvet Cake MIUI V13 (Android 11)
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.0 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B5 (850), B8 (900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)