hisense A9 Pro vs Ulefone Armor 23 Ultra

At a glance

Brand: HiSense; Ulefone
Release date: March 2023, 3 years 4 months ago; December 2023, 2 years 7 months ago
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 854.012 Antutu v10 Overall performance better than 82% of devices

Size: 6.1"; 6.78"
Resolution: 824 x 1648 px FHD; 1080 x 2460 px FHD+
Type: eInk E INK Carta 1200; LCD IPS
Density: 302 ppi High Density; 396 ppi High Density
Aspect ratio: 18:9; 21:9
Features: Water Drop Notch, Capacitive, Multi-touch, Frameless; Water Drop Notch, Refresh rate 120 Hz, LED Notifications, Scratch resistant, Corning Gorilla Glass Victus, Capacitive, Multi-touch, Oleophobic coating

Chipset: Qualcomm Snapdragon 662; МеdiаТеk Dimеnsity 8020
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 4x 2.6 GHz Cortex A78 +4x 2.0 GHz Cortex A55
CPU type: Octa-Core; Octa-Core
Process: 11 nm; 6 nm
Frequency: 2 GHz; 2.6 GHz
GPU: Qualcomm Adreno 610; ARM Mali-G77 MC9
RAM: 8 GB; 12 GB
64-bit: Yes; Yes
RAM type: —; LPDDR4X RAM

Resolution: 13 Mpx; 50 Mpx
Aperture: Unknow; ƒ/ 1.7
Flash: LED; Dual LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Flicker sensor, 4K Video, Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacity: 256 GB; 512 GB
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Type: —; UFS Storage 2.1

Dimensions: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 81.5 mm 177.4 mm 12.8 mm Print 3D Model
Weight: 183 g; 332 g
Materials: Plastic; Rugged Smartphone, Polycarbonate
Colors: Black; Black Orange
Usable surface: 76 %; 73 %
Water/dust resistance: —; IP68, MIL-STD-810G , IP69
Drop resistance: —; Class A B C D E 270 drops without defects
Repairability: —; Class A B C D E

Operating system: Android 12 Snow Cone Android 12; Android 13 Tiramisu Android 13
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.1 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac, WiFi 6 (802.11ax)
Wi-Fi features: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo, GPS (L1+L5)

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100), B71 (600)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), CDMA BC1 (1900), B2 (1900), B3 (1800), B5 (850), B8 (900)
5G: —; n1 (2100), n2 (1900 PCS), n3 (1800), n5 (850), n7 (2600), n8 (900), n20 (800), n25 (1900), n28b (700), n28a (700), n38 (2600), n40 (2300), n41 (2500), n66 (1700), n71 (600), n77 (3700), n78 (3500), n79 (4700)