hisense A9 Pro vs Samsung Galaxy F54

At a glance

Brand: HiSense; Samsung
Release date: March 2023, 3 years 2 months ago; June 2023, 2 years 11 months ago
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 507.000 Antutu v9 Overall performance better than 73% of devices

Size: 6.1"; 6.7"
Resolution: 824 x 1648 px FHD; 1080 x 2400 px FHD+
Type: eInk E INK Carta 1200; Super AMOLED
Density: 302 ppi High Density; 393 ppi High Density
Aspect ratio: 18:9; 20:9
Features: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, Refresh rate 120 Hz, Scratch resistant, 2.5D curved glass screen, Corning Gorilla Glass 5, Capacitive, Multi-touch, Frameless

Chipset: Qualcomm Snapdragon 662; Exynos 1380
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 4x2.4GHz ARM Cortex A78 + 4x2.0 GHz ARM Cortex A55
CPU type: Octa-Core; Octa-Core
Process: 11 nm; 5 nm
Frequency: 2 GHz; 2.4 GHz
GPU: Qualcomm Adreno 610; ARM Mali-G68 MP5
RAM: 8 GB; 8 GB
64-bit: Yes; Yes
RAM type: —; LPDDR4X RAM

Resolution: 13 Mpx; 108 Mpx
Aperture: Unknow; ƒ/ 1.8
Flash: LED; LED
Optical stabilization: No; Yes
Slow motion: No, 30 fps; Yes, 240 fps
Features: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; 4K Video, Digital zoom, Triple camera, Digital image stabilization, Optical Stabilization (OIS), Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Samsung HM6
Pixel size: —; 0.64 µm
Sensor size: —; 1/1.67"

Capacity: 256 GB; 256 GB
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 77.3 mm 164.9 mm 8.4 mm Print 3D Model
Weight: 183 g; 199 g
Materials: Plastic; Plastic
Colors: Black; Blue Silver
Usable surface: 76 %; 85 %

Operating system: Android 12 Snow Cone Android 12; Android 13 Tiramisu Android 13
Google services: With Google Mobile Services; With Google Mobile Services
Updates: —; OS updates: 2 years, Security updates: 4 years

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.3
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), AVRCP (Audio/Visual Remote Control Profile), DIP (Device ID Profile), HFP (Hands-Free Profile), HID (Human Interface Profile), HSP (Headset Profile), MAP (Message Access Profile), PAN (Personal Area Networking Profile), OPP (Object Push Profile), PBAP/PAB (Phone Book Access Profile), HOGP, LDAC, SBC
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac, WiFi 6 (802.11ax)
Wi-Fi features: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, QZSS, Galileo, NavIC System

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B20 (800), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)
5G: —; n1 (2100), n3 (1800), n5 (850), n7 (2600), n8 (900), n28b (700), n28a (700), n40 (2300), n41 (2500), n77 (3700), n78 (3500)