hisense A9 Pro vs philips S6310

hisense A9 Pro
hisense
A9 Pro
philips S6310
philips
S6310

At a glance

Brand
HiSense
Philips
Release date
March 2023, 3 years 3 months ago
November 2024, 1 years 7 months ago
AnTuTu
102.000 Antutu v9 Overall performance better than 51% of devices
237.000 Antutu v10 Overall performance better than 57% of devices

Display

Size
6.1"
6.56"
Resolution
824 x 1648 px FHD
720 x 1612 px HD+
Type
eInk E INK Carta 1200
LCD IPS
Density
302 ppi High Density
269 ppi Medium Density
Aspect ratio
18:9
20:9
Features
Water Drop Notch, Capacitive, Multi-touch, Frameless
Hole-punch Notch, Refresh rate 90 Hz, Capacitive, Multi-touch, Frameless

Performance

Chipset
Qualcomm Snapdragon 662
Unisoc Tiger T606
CPU
4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz
2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55
CPU type
Octa-Core
Octa-Core
Process
11 nm
12 nm
Frequency
2 GHz
1.6 GHz
GPU
Qualcomm Adreno 610
ARM Mali-G57
RAM
8 GB
4 GB
64-bit
Yes
Yes

Rear camera

Resolution
13 Mpx
50 Mpx
Aperture
Unknow
Unknow
Flash
LED
LED
Optical stabilization
No
No
Slow motion
No, 30 fps
No, 30 fps
Features
Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Digital zoom, Triple camera, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Front camera

Resolution
5 Mpx
8 Mpx
Aperture
ƒ/ 2.0
Unknow
Sensor
Samsung S5K4H7
Pixel size
1.12 µm

Battery

Capacity
4000 mAh
5000 mAh
Type
Li-Ion
Li-Ion
Fast charge
No
Yes , 10.0W
Features
Non-removable
Non-removable

Storage

Capacity
256 GB
128 GB
SD slot
Yes , Slot for SD or second SIM card
Yes , Slot for SD or second SIM card
Type
eMMC 5.1 Storage

Body

Dimensions
79.5 mm 159.0 mm 7.8 mm Print 3D Model
76.0 mm 163.5 mm 8.5 mm Print 3D Model
Weight
183 g
200 g
Materials
Plastic
Plastic
Colors
Black
Black
Usable surface
76 %
83 %

Software

Operating system
Android 12 Snow Cone Android 12
Android 14 Upside-down cake Android 14
Google services
With Google Mobile Services
With Google Mobile Services

Connectivity

SIM
Dual SIM Dual Standby (Nano SIM + Nano SIM)
Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth
Bluetooth 5.1
Bluetooth 4.2
Bluetooth profiles
A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC
A2DP (Advanced Audio Distribution Profile)
Wi-Fi
802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features
Dual band, Wi-Fi Hotspot
Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB
USB Type-C
USB Type-C
USB features
Charging, OTG
Charging, OTG
Navigation
GPS, A-GPS
GPS, A-GPS, GLONASS, Beidou, Galileo

Networks

4G LTE
B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
B1 (2100), B3 (1800), B7 (2600), B8 (900), B20 (800), B28a (700), B40 (TDD 2300)
3G
B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
B1 (2100), B8 (900)
2G
B2 (1900), B3 (1800), B5 (850), B8 (900)
B3 (1800), B8 (900)

Sensors & security

Fingerprint
Yes, on the side
Yes, on the side
Accelerometer
Yes
Yes
Proximity
Yes
Yes
Light sensor
Yes
Yes
Cooling system
No
No
Audio
Stereo Speakers
2 microphones

Compared with hisense A9 Pro

  • hisense
    A9 Pro
    8 GB · 6.1" · Qualcomm Snapdragon 662
    hisense A9 Pro
    hisense E50i
    hisense
    E50i
    3 GB · 6.52" · MediaTek Helio G37
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  • hisense
    A9 Pro
    8 GB · 6.1" · Qualcomm Snapdragon 662
    hisense A9 Pro
    Blackview BV9200
    Blackview
    BV9200
    8 GB · 6.6" · MediaTek Helio G96
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  • hisense
    A9 Pro
    8 GB · 6.1" · Qualcomm Snapdragon 662
    hisense A9 Pro
    Blackview Shark 8
    Blackview
    Shark 8
    8 GB · 6.78" · MediaTek Helio G99 (MT6789)
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  • hisense
    A9 Pro
    8 GB · 6.1" · Qualcomm Snapdragon 662
    hisense A9 Pro
    coolpad COOL 20s
    coolpad
    COOL 20s
    4 GB · 6.58" · MediaTek Dimensity 700 (MT6833)
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  • hisense
    A9 Pro
    8 GB · 6.1" · Qualcomm Snapdragon 662
    hisense A9 Pro
    blu F91 5G
    blu
    F91 5G
    8 GB · 6.8" · MediaTek Dimensity 810 (MT6873)
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  • hisense
    A9 Pro
    8 GB · 6.1" · Qualcomm Snapdragon 662
    hisense A9 Pro
    Apple iPhone 13 Pro Max
    Apple
    iPhone 13 Pro Max
    6 GB · 6.7" · Apple A15 Bionic
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  • hisense
    A9 Pro
    8 GB · 6.1" · Qualcomm Snapdragon 662
    hisense A9 Pro
    Blackview A70
    Blackview
    A70
    3 GB · 6.52" · Spreadtrum Unisoc SC9863A
    View comparison

Compared with philips S6310

  • philips
    S6310
    4 GB · 6.56" · Unisoc Tiger T606
    philips S6310
    Blackview Oscal PIlot 2
    Blackview
    Oscal PIlot 2
    8 GB · 6.5" · MediaTek Helio G99 (MT6789)
    View comparison
  • philips
    S6310
    4 GB · 6.56" · Unisoc Tiger T606
    philips S6310
    Blackview Wave 8C
    Blackview
    Wave 8C
    2 GB · 6.56" · Spreadtrum Unisoc SC9863A
    View comparison
  • philips
    S6310
    4 GB · 6.56" · Unisoc Tiger T606
    philips S6310
    Blackview A200 Pro
    Blackview
    A200 Pro
    12 GB · 6.67" · MediaTek Helio G99 (MT6789)
    View comparison
  • philips
    S6310
    4 GB · 6.56" · Unisoc Tiger T606
    philips S6310
    Blackview BV9300
    Blackview
    BV9300
    12 GB · 6.7" · MediaTek Helio G99 (MT6789)
    View comparison
  • philips
    S6310
    4 GB · 6.56" · Unisoc Tiger T606
    philips S6310
    CAT S53
    CAT
    S53
    6 GB · 6.5" · Qualcomm Snapdragon 480
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  • philips
    S6310
    4 GB · 6.56" · Unisoc Tiger T606
    philips S6310
    Blackview BV5200
    Blackview
    BV5200
    4 GB · 6.1" · MediaTek Helio A22 (MT6761)
    View comparison