hisense A9 Pro vs Oukitel WP55 Ultra

At a glance

Brand: HiSense; Oukitel
Release date: March 2023, 3 years 4 months ago; September 2025, 10 months ago
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 488.900 Antutu v10 Overall performance better than 73% of devices

Size: 6.1"; 6.58"
Resolution: 824 x 1648 px FHD; 1080 x 2408 px FHD+
Type: eInk E INK Carta 1200; AMOLED
Density: 302 ppi High Density; 401 ppi Very high density
Aspect ratio: 18:9; 20:9
Features: Water Drop Notch, Capacitive, Multi-touch, Frameless; Water Drop Notch, Refresh rate 120 Hz, Scratch resistant, Corning Gorilla Glass 5, Capacitive, Multi-touch

Chipset: Qualcomm Snapdragon 662; MediaTek Dimensity 7025
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x2.5 GHz ARM Cortex A78+6x 2.0 GHz ARM Cortex A55
CPU type: Octa-Core; Octa-Core
Process: 11 nm; 6 nm
Frequency: 2 GHz; 2.5 GHz
GPU: Qualcomm Adreno 610; IMG BXM-8-256
RAM: 8 GB; 12 GB
64-bit: Yes; Yes
RAM type: —; RAM LPDDR5X

Resolution: 13 Mpx; 108 Mpx
Aperture: Unknow; ƒ/ 1.89
Flash: LED; LED
Optical stabilization: No; No
Slow motion: No, 30 fps; Yes, 120 fps
Features: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Triple camera, Digital image stabilization, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer, Front Flash, Night Mode, Night Vision
Sensor: —; Samsung HM6
Pixel size: —; 0.64 µm
Sensor size: —; 1/1.67"

Capacity: 256 GB; 512 GB
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Type: —; UFS Storage 3.1

Dimensions: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 81.0 mm 172.2 mm 15.3 mm Print 3D Model
Weight: 183 g; 367 g
Materials: Plastic; Rugged Smartphone, Plastic
Colors: Black; Black White Red Gray
Usable surface: 76 %; 74 %
Water/dust resistance: —; IP68, IP69 , MIL-STD-810H
Drop resistance: —; Class A B C D E 270 drops without defects
Repairability: —; Class A B C D E

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.2 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), LE (Low Energy), LDAC, AAC
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac, WiFi 6 (802.11ax)
Wi-Fi features: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display, Wi-Fi MiMO
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, QZSS, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100), B71 (600)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), CDMA BC1 (1900), CDMA BC10 (800 Secondary), B2 (1900), B3 (1800), B5 (850), B8 (900)
5G: —; n1 (2100), n2 (1900 PCS), n3 (1800), n5 (850), n7 (2600), n8 (900), n12 (700), n20 (800), n25 (1900), n26 (850), n28b (700), n28a (700), n38 (2600), n40 (2300), n41 (2500), n66 (1700), n71 (600), n77 (3700), n78 (3500)