hisense A9 Pro vs Oukitel WP23 Plus

At a glance

Brand: HiSense; Oukitel
Release date: March 2023, 3 years 3 months ago; March 2025, 1 years 3 months ago
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 251.400 Antutu v10 Overall performance better than 59% of devices

Size: 6.1"; 6.52"
Resolution: 824 x 1648 px FHD; 720 x 1600 px HD+
Type: eInk E INK Carta 1200; LCD IPS
Density: 302 ppi High Density; 269 ppi Medium Density
Aspect ratio: 18:9; 20:9
Features: Water Drop Notch, Capacitive, Multi-touch, Frameless; Water Drop Notch, Brightnes 400 cd/m² (typ), 2.5D curved glass screen, Capacitive, Multi-touch

Chipset: Qualcomm Snapdragon 662; Unisoc Tiger T606
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55
CPU type: Octa-Core; Octa-Core
Process: 11 nm; 12 nm
Frequency: 2 GHz; 1.6 GHz
GPU: Qualcomm Adreno 610; ARM Mali-G57
RAM: 8 GB; 8 GB
64-bit: Yes; Yes
RAM type: —; LPDDR4X RAM

Resolution: 13 Mpx; 13 Mpx
Aperture: Unknow; Unknow
Flash: LED; LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Triple camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Sony IMX135 Exmor RS
Pixel size: —; 1.12 µm
Sensor size: —; 1/3.06"

Capacity: 256 GB; 256 GB
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 84.0 mm 176.0 mm 17.0 mm Print 3D Model
Weight: 183 g; 360 g
Materials: Plastic; Rugged Smartphone, Polycarbonate , Metal
Colors: Black; Black Green Orange
Usable surface: 76 %; 80 %
Water/dust resistance: —; IP68, IP69 , MIL-STD-810H
Drop resistance: —; Class A B C D E 270 drops without defects
Repairability: —; Class A B C D E

Operating system: Android 12 Snow Cone Android 12; Android 14 Upside-down cake Android 14
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.0 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B7 (2600), B8 (900), B19 (800), B20 (800)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), B2 (1900), B3 (1800), B5 (850), B8 (900)