hisense A9 Pro vs iiif150 B2 Ultra

At a glance

Brand: HiSense; iiiF150
Release date: March 2023, 3 years 2 months ago; August 2023, 2 years 9 months ago
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 415.300 Antutu v10 Overall performance better than 68% of devices

Size: 6.1"; 6.8"
Resolution: 824 x 1648 px FHD; 1080 x 2460 px FHD+
Type: eInk E INK Carta 1200; LCD IPS
Density: 302 ppi High Density; 395 ppi High Density
Aspect ratio: 18:9; 21:9
Features: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, Refresh rate 120 Hz, Color LED Notifications, Corning Gorilla Glass 5, Capacitive, Multi-touch

Chipset: Qualcomm Snapdragon 662; MediaTek Helio G99 (MT6789)
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz
CPU type: Octa-Core; Octa-Core
Process: 11 nm; 6 nm
Frequency: 2 GHz; 2.2 GHz
GPU: Qualcomm Adreno 610; Mali-G57 MC2
RAM: 8 GB; 12 GB
64-bit: Yes; Yes
RAM type: —; LPDDR4X RAM

Resolution: 13 Mpx; 200 Mpx
Aperture: Unknow; ƒ/ 1.65
Flash: LED; Triple LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Samsung ISOCELL HP3
Pixel size: —; 0.56 µm
Sensor size: —; 1/1.4"

Capacity: 256 GB; 256 GB
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Type: —; UFS Storage 2.2

Dimensions: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 81.8 mm 176.4 mm 19.9 mm Print 3D Model
Weight: 183 g; 465 g
Materials: Plastic; TPU , Rugged Smartphone, Titanium-aluminium alloy
Colors: Black; Black
Usable surface: 76 %; 74 %
Water/dust resistance: —; IP68, IP69 , MIL-STD-810H

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.2
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC10 (800 Secondary), B2 (1900), B3 (1800), B5 (850), B8 (900)