hisense A9 Pro vs iiif150 Action A5 Pro

At a glance

Brand: HiSense; iiiF150
Release date: March 2023, 3 years 4 months ago; June 2025, 1 years 1 months ago
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 239.545 Antutu v10 Overall performance better than 57% of devices

Size: 6.1"; 6.88"
Resolution: 824 x 1648 px FHD; 720 x 1640 px HD+
Type: eInk E INK Carta 1200; LCD IPS
Density: 302 ppi High Density; 260 ppi Medium Density
Aspect ratio: 18:9; 21:9
Features: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, Brightnes 500 cd/m² (typ), 2.5D curved glass screen, Capacitive, Multi-touch, Frameless, In-cell

Chipset: Qualcomm Snapdragon 662; Unisoc Tiger T603
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2xCortex A75 1.8GHz + 6x Cortex A55 1.6GHz
CPU type: Octa-Core; Octa-Core
Process: 11 nm; 12 nm
Frequency: 2 GHz; 1.8 GHz
GPU: Qualcomm Adreno 610; Mali-G57 MP1
RAM: 8 GB; 3 GB
64-bit: Yes; Yes

Resolution: 13 Mpx; 16 Mpx
Aperture: Unknow; ƒ/ 1.8
Flash: LED; LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacity: 256 GB; 256 GB
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 78.3 mm 172.6 mm 8.2 mm Print 3D Model
Weight: 183 g; 207 g
Materials: Plastic; Plastic
Colors: Black; Black Blue Green Violet Pearl Titanium
Usable surface: 76 %; 83 %
Water/dust resistance: —; IP68, IP69 , MIL-STD-810H

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 4.2
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11b , 802.11g , 802.11n
Wi-Fi features: Dual band, Wi-Fi Hotspot; Wi-Fi Hotspot
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B3 (1800), B8 (900)