hisense A9 Pro vs hotwav Note 15

At a glance

Brand: HiSense; Hotwav
Release date: March 2023, 3 years 3 months ago; August 2024, 1 years 10 months ago
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 154.110 Antutu v10 Overall performance better than 54% of devices

Size: 6.1"; 6.6"
Resolution: 824 x 1648 px FHD; 720 x 1612 px HD+
Type: eInk E INK Carta 1200; LCD IPS
Density: 302 ppi High Density; 267 ppi Medium Density
Aspect ratio: 18:9; 20:9
Features: Water Drop Notch, Capacitive, Multi-touch, Frameless; Water Drop Notch, Brightnes 400 cd/m² (typ), Max brightness HBM - 500 cd/m², 2.5D curved glass screen, Capacitive, Multi-touch, Frameless

Chipset: Qualcomm Snapdragon 662; Spreadtrum Unisoc SC9863A
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 4x Cortex A55 1.6 GHz + 4x Cortex A55 1.2 GHz
CPU type: Octa-Core; Octa-Core
Process: 11 nm; 28 nm
Frequency: 2 GHz; 1.6 GHz
GPU: Qualcomm Adreno 610; PowerVR GE8322
RAM: 8 GB; 4 GB
64-bit: Yes; Yes
RAM type: —; LPDDR4X RAM

Resolution: 13 Mpx; 13 Mpx
Aperture: Unknow; ƒ/ 1.8
Flash: LED; LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacity: 256 GB; 64 GB
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Type: —; UFS Storage 2.1

Dimensions: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 74.7 mm 164.3 mm 7.9 mm Print 3D Model
Weight: 183 g; 200 g
Materials: Plastic; Plastic
Colors: Black; Black Blue Violet
Usable surface: 76 %; 85 %
Drop resistance: —; Class A B C D E 270 drops without defects
Repairability: —; Class A B C D E

Operating system: Android 12 Snow Cone Android 12; Android 14 Upside-down cake Android 14
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.0 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)