hisense A9 Pro vs hotwav Hyper 8 Ultra

At a glance

Brand: HiSense; Hotwav
Release date: March 2023, 3 years 4 months ago; December 2025, 7 months ago
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 623.559 Antutu v10 Overall performance better than 77% of devices

Size: 6.1"; 6.8"
Resolution: 824 x 1648 px FHD; 1080 x 2400 px FHD+
Type: eInk E INK Carta 1200; LCD IPS
Density: 302 ppi High Density; 396 ppi High Density
Aspect ratio: 18:9; 21:9
Features: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, SGS Certified, Refresh rate 120 Hz, Peak brightness - 650 cd/m², 580 cd/m² peak brightness, Corning Gorilla Glass 3, Capacitive, Multi-touch

Chipset: Qualcomm Snapdragon 662; MediaTek Dimensity 7050 (MT6877)
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x2.6 GHz ARM Cortex A78+6x 2.0 GHz ARM Cortex A55
CPU type: Octa-Core; Octa-Core
Process: 11 nm; 6 nm
Frequency: 2 GHz; 2.6 GHz
GPU: Qualcomm Adreno 610; Mali-G68 MC4
RAM: 8 GB; 12 GB
64-bit: Yes; Yes
RAM type: —; RAM LPDDR5

Resolution: 13 Mpx; 108 Mpx
Aperture: Unknow; ƒ/ 1.79
Flash: LED; Triple LED
Optical stabilization: No; No
Slow motion: No, 30 fps; Yes, 120 fps
Features: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Samsung HM6
Pixel size: —; 0.70 µm
Sensor size: —; 1/1.67"

Dimensions: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 83.0 mm 180.2 mm 22.0 mm Print 3D Model
Weight: 183 g; 525 g
Materials: Plastic; TPU , Rugged Smartphone
Colors: Black; Black Orange
Usable surface: 76 %; 71 %
Water/dust resistance: —; IP68, IP69 , MIL-STD-810H
Drop resistance: —; Class A B C D E 270 drops without defects
Repairability: —; Class A B C D E

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.2
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac, WiFi 6 (802.11ax)
Wi-Fi features: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B30 (2300), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), CDMA BC1 (1900), CDMA BC10 (800 Secondary), B2 (1900), B3 (1800), B5 (850), B8 (900)
5G: —; n1 (2100), n5 (850), n7 (2600), n8 (900), n20 (800), n28b (700), n28a (700), n38 (2600), n40 (2300), n41 (2500), n77 (3700), n78 (3500)