hisense A9 Pro vs hotwav Hyper 7 Pro 5G

At a glance

Brand: HiSense; Hotwav
Release date: March 2023, 3 years 4 months ago; November 2024, 1 years 8 months ago
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 550.000 Antutu v10 Overall performance better than 74% of devices

Size: 6.1"; 6.6"
Resolution: 824 x 1648 px FHD; 1080 x 2408 px FHD+
Type: eInk E INK Carta 1200; AMOLED
Density: 302 ppi High Density; 395 ppi High Density
Aspect ratio: 18:9; 21:9
Features: Water Drop Notch, Capacitive, Multi-touch, Frameless; Water Drop Notch, Refresh rate 120 Hz, Brightnes 500 cd/m² (typ), Max brightness HBM - 550 cd/m², Peak brightness - 2600 cd/m², DCI-P3, Capacitive, Multi-touch

Chipset: Qualcomm Snapdragon 662; MediaTek Dimensity 7050 (MT6877)
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x2.6 GHz ARM Cortex A78+6x 2.0 GHz ARM Cortex A55
CPU type: Octa-Core; Octa-Core
Process: 11 nm; 6 nm
Frequency: 2 GHz; 2.6 GHz
GPU: Qualcomm Adreno 610; Mali-G68 MC4
RAM: 8 GB; 16 GB
64-bit: Yes; Yes
RAM type: —; RAM LPDDR5

Resolution: 13 Mpx; 200 Mpx
Aperture: Unknow; ƒ/ 1.88
Flash: LED; Dual LED
Optical stabilization: No; No
Slow motion: No, 30 fps; Yes, 120 fps
Features: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Samsung

Dimensions: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 82.3 mm 174.6 mm 18.2 mm Print 3D Model
Weight: 183 g; 397 g
Materials: Plastic; TPU , Rugged Smartphone
Colors: Black; Black Red Beige
Usable surface: 76 %; 73 %
Water/dust resistance: —; IP68, IP69 , MIL-STD-810H
Drop resistance: —; Class A B C D E 270 drops without defects
Repairability: —; Class A B C D E

Operating system: Android 12 Snow Cone Android 12; Android 14 Upside-down cake Android 14
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.2
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), B2 (1900), B3 (1800), B5 (850), B8 (900)
5G: —; n1 (2100), n2 (1900 PCS), n7 (2600), n8 (900), n20 (800), n25 (1900), n28b (700), n28a (700), n38 (2600), n40 (2300), n41 (2500), n66 (1700), n77 (3700), n78 (3500)