Cubot X100 vs hotwav T7

At a glance

Brand: Cubot; Hotwav
Release date: September 2025, 9 months ago; July 2024, 1 years 11 months ago
AnTuTu: 470.000 Antutu v10 Overall performance better than 72% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Size: 6.88"; 6.6"
Resolution: 720 x 1640 px HD+; 1080 x 2460 px FHD+
Type: LCD IPS; LCD IPS
Density: 260 ppi Medium Density; 407 ppi Very high density
Aspect ratio: 21:9; 21:9
Features: Water Drop Notch, Refresh rate 120 Hz, Touch sampling rate 240 Hz, 1400:1 contrast ratio, Color LED Notifications, Scratch resistant, Corning Gorilla Glass, Capacitive, Multi-touch, Frameless; Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch

Chipset: MediaTek Dimensity 7025; MediaTek MT8788V
CPU: 2x2.5 GHz ARM Cortex A78+6x 2.0 GHz ARM Cortex A55; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
CPU type: Octa-Core; Octa-Core
Process: 6 nm; 12 nm
Frequency: 2.5 GHz; 2 GHz
GPU: IMG BXM-8-256; Mali-G72 MP3
RAM: 8 GB; 4 GB
RAM type: RAM LPDDR5; LPDDR4X RAM
64-bit: Yes; Yes

Resolution: 64 Mpx; 21 Mpx
Aperture: ƒ/ 1.8; Unknow
Flash: LED; LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: 4K Video, Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Sony Exmor

Capacity: 256 GB; 128 GB
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Type: —; eMMC 5.1 Storage

Dimensions: 78.1 mm 171.9 mm 8.9 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Weight: 208 g; 292 g
Materials: Plastic; Rugged Smartphone, Plastic , Faux leather
Colors: Black Gold; Black Orange
Drop resistance: Class A B C D E 270 drops without defects; —
Repairability: Class A B C D E; —
Usable surface: 83 %; 71 %
Water/dust resistance: —; IP68, IP69 , MIL-STD-810H

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.2 LELow energy consumption; Bluetooth 5.0 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac, WiFi 6 (802.11ax); 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

5G: n1 (2100), n3 (1800), n7 (2600), n28b (700), n28a (700), n38 (2600), n41 (2500), n77 (3700), n78 (3500), n79 (4700); —
4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: CDMA BC0 (800), CDMA BC1 (1900), B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)