Cubot KingKong X vs hotwav T7

At a glance

Brand: Cubot; Hotwav
Release date: June 2024, 2 years ago; July 2024, 1 years 11 months ago
AnTuTu: 545.000 Antutu v10 Overall performance better than 74% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Size: 6.58"; 6.6"
Resolution: 1080 x 2408 px FHD+; 1080 x 2460 px FHD+
Type: LCD IPS; LCD IPS
Density: 401 ppi Very high density; 407 ppi Very high density
Aspect ratio: 20:9; 21:9
Features: Water Drop Notch, Secondary rear display, Refresh rate 120 Hz, Capacitive, Multi-touch; Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch

Chipset: MediaTek Dimensity 7050 (MT6877); MediaTek MT8788V
CPU: 2x2.6 GHz ARM Cortex A78+6x 2.0 GHz ARM Cortex A55; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
CPU type: Octa-Core; Octa-Core
Process: 6 nm; 12 nm
Frequency: 2.6 GHz; 2 GHz
GPU: Mali-G68 MC4; Mali-G72 MP3
RAM: 16 GB; 4 GB
RAM type: RAM LPDDR5; LPDDR4X RAM
64-bit: Yes; Yes

Resolution: 100 Mpx; 21 Mpx
Aperture: ƒ/ 1.89; Unknow
Sensor: Omnivision OVA0B40; Sony Exmor
Pixel size: 0.61 µm; —
Sensor size: 1/1.8"; —
Flash: Dual LED; LED
Optical stabilization: No; No
Slow motion: Yes, 120 fps; No, 30 fps
Features: 4K Video, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Geotagging, Panorama, HDR, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacity: 256 GB; 128 GB
Type: UFS Storage 3.1; eMMC 5.1 Storage
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 82.2 mm 170.9 mm 18.7 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Weight: 388 g; 292 g
Materials: TPU , Rugged Smartphone; Rugged Smartphone, Plastic , Faux leather
Colors: Black; Black Orange
Water/dust resistance: IP68, IP69 , MIL-STD-810H; IP68, IP69 , MIL-STD-810H
Drop resistance: Class A B C D E 270 drops without defects; —
Repairability: Class A B C D E; —
Usable surface: 74 %; 71 %

Operating system: Android 14 Upside-down cake Android 14; Android 13 Tiramisu Android 13
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1 LELow energy consumption; Bluetooth 5.0 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac, WiFi 6 (802.11ax); 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display, Wi-Fi MiMO; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo
USB: —; USB Type-C

5G: n1 (2100), n3 (1800), n5 (850), n7 (2600), n8 (900), n28b (700), n28a (700), n38 (2600), n41 (2500), n77 (3700), n78 (3500); —
4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)