Cubot KingKong X Pro vs TCL 505

At a glance

Brand: Cubot; TCL
Release date: October 2024, 1 years 7 months ago; February 2024, 2 years 3 months ago
AnTuTu: 918.000 Antutu v10 Overall performance better than 84% of devices; 125.000 Antutu v9 Overall performance better than 53% of devices

Size: 6.72"; 6.75"
Resolution: 1080 x 2408 px FHD+; 720 x 1600 px HD+
Type: LCD IPS; LCD IPS
Density: 401 ppi Very high density; 260 ppi Medium Density
Aspect ratio: 20:9; 20:9
Features: Water Drop Notch, Refresh rate 144 Hz, Capacitive, Multi-touch; Water Drop Notch, Refresh rate 90 Hz, Scratch resistant, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless

Chipset: MediaTek Dimensity 8200 (MT6896); Mediatek Helio G35
CPU: 1x Cortex A78 3.1 GHz + 3x Cortex A78 3.0 GHz + 4x Cortex A55 2.0 GHz; 8x Cortex A53 2.3 GHz
CPU type: Octa-Core; Octa-Core
Process: 4 nm; 12 nm
Frequency: 3.1 GHz; 2.3 GHz
GPU: Arm Mali-G610 MC6; IMG PowerVR GE8320 680MHz
RAM: 12 GB; 4 GB
RAM type: RAM LPDDR5; LPDDR4X RAM
64-bit: Yes; Yes

Resolution: 100 Mpx; 50 Mpx
Aperture: ƒ/ 1.89; ƒ/ 1.8
Pixel size: 0.61 µm; 0.70 µm
Flash: Dual LED; LED
Optical stabilization: No; No
Slow motion: Yes, 120 fps; No, 30 fps
Features: 4K Video, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Geotagging, Panorama, HDR, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Hynix Hi-5021Q
Sensor size: —; 1/2.55"

Capacity: 256 GB; 64 GB
Type: UFS Storage 3.1; eMMC 5.1 Storage
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 82.2 mm 170.9 mm 18.7 mm Print 3D Model; 76.7 mm 168.3 mm 8.3 mm Print 3D Model
Weight: 388 g; 190 g
Materials: TPU , Rugged Smartphone; Polycarbonate
Colors: Black; Black Blue
Water/dust resistance: IP68, IP69 , MIL-STD-810H; —
Drop resistance: Class A B C D E 270 drops without defects; —
Repairability: Class A B C D E; —
Usable surface: 74 %; 85 %

Operating system: Android 14 Upside-down cake Android 14; Android 14 Upside-down cake Android 14
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.3 LELow energy consumption; Bluetooth 5.1 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac, WiFi 6 (802.11ax); 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display, Wi-Fi MiMO; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo
USB: —; USB Type-C

5G: n1 (2100), n3 (1800), n5 (850), n7 (2600), n8 (900), n28b (700), n28a (700), n38 (2600), n41 (2500), n77 (3700), n78 (3500); —
4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100), B71 (600); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)