Cubot KingKong Star 2 vs hotwav T7 Pro

At a glance

Brand: Cubot; Hotwav
Release date: October 2024, 1 years 7 months ago; June 2024, 1 years 11 months ago
AnTuTu: 990.000 Antutu v10 Overall performance better than 84% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Size: 6.72"; 6.6"
Resolution: 1080 x 2400 px FHD+; 1080 x 2460 px FHD+
Type: LCD IPS; LCD IPS
Density: 392 ppi High Density; 407 ppi Very high density
Aspect ratio: 20:9; 21:9
Features: Water Drop Notch, Refresh rate 144 Hz, Peak brightness - 1500 cd/m², Corning Gorilla Glass, 2.5D curved glass screen, Capacitive, Multi-touch, In-cell; Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch

Chipset: MediaTek Dimensity 8200 (MT6896); MediaTek MT8788V
CPU: 1x Cortex A78 3.1 GHz + 3x Cortex A78 3.0 GHz + 4x Cortex A55 2.0 GHz; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
CPU type: Octa-Core; Octa-Core
Process: 4 nm; 12 nm
Frequency: 3.1 GHz; 2 GHz
GPU: Arm Mali-G610 MC6; Mali-G72 MP3
RAM: 12 GB; 6 GB
RAM type: RAM LPDDR5; LPDDR4X RAM
64-bit: Yes; Yes

Resolution: 100 Mpx; 64 Mpx
Aperture: Unknow; Unknow
Pixel size: 0.80 µm; —
Flash: Dual LED; LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Triple camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Scene mode, Self-timer, Night Vision; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Dimensions: 81.8 mm 177.7 mm 13.5 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Weight: 305 g; 292 g
Materials: Rugged Smartphone, Metal; Rugged Smartphone, Plastic , Faux leather
Colors: Black Red; Black Orange
Water/dust resistance: IP68, IP69 , MIL-STD-810H; IP68, IP69 , MIL-STD-810H
Drop resistance: Class A B C D E 270 drops without defects; Class A B C D E 270 drops without defects
Repairability: Class A B C D E; Class A B C D E
Usable surface: 75 %; 71 %

Operating system: Android 14 Upside-down cake Android 14; Android 13 Tiramisu Android 13
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.0 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac, WiFi 6 (802.11ax); 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo, GPS (L1+L5), BeiDou (B1), Galileo (E1+E5a), BeiDou (B2); GPS, A-GPS, GLONASS, Beidou, Galileo

5G: n1 (2100), n2 (1900 PCS), n3 (1800), n5 (850), n7 (2600), n8 (900), n20 (800), n25 (1900), n28b (700), n28a (700), n38 (2600), n41 (2500), n66 (1700), n77 (3700), n78 (3500); —
4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100), B71 (600); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)