Cubot KingKong Power 3 vs hotwav Cyber 7

At a glance

Brand: Cubot; Hotwav
Release date: October 2024, 1 years 8 months ago; April 2022, 4 years 2 months ago
AnTuTu: 411.163 Antutu v10 Overall performance better than 68% of devices; 378.600 Antutu v10 Overall performance better than 64% of devices

Size: 6.72"; 6.3"
Resolution: 1080 x 2408 px FHD+; 1080 x 2340 px FHD+
Type: LCD IPS; LCD IPS
Density: 401 ppi Very high density; 409 ppi Very high density
Aspect ratio: 20:9; 19.5:9
Features: Water Drop Notch, Refresh rate 120 Hz, 2.5D curved glass screen, Capacitive, Multi-touch, In-cell; Hole-punch Notch, Brightnes 450 cd/m² (typ), 1000:1 contrast ratio, 1500:1 contrast ratio, Scratch resistant, Corning Gorilla Glass, Capacitive, Multi-touch

Chipset: MediaTek Helio G99 (MT6789); MediaTek Dimensity 700 (MT6833)
CPU: 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz; 4x Cortex A76 2.2 GHz + 4x Cortex A55 2.0 GHz
CPU type: Octa-Core; Octa-Core
Process: 6 nm; 7 nm
Frequency: 2.2 GHz; 2.2 GHz
GPU: Mali-G57 MC2; Arm Mali-G57 MC2
RAM: 6 GB; 8 GB
RAM type: LPDDR4X RAM; LPDDR4X RAM
64-bit: Yes; Yes

Resolution: 100 Mpx; 48 Mpx
Aperture: Unknow; ƒ/ 1.8
Pixel size: 0.80 µm; 0.80 µm
Flash: LED; LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Triple camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Scene mode, Self-timer; Digital zoom, Quadruple camera, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacity: 256 GB; 128 GB
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Type: —; UFS Storage 2.2

Dimensions: 82.7 mm 165.3 mm 20.0 mm Print 3D Model; 81.0 mm 168.0 mm 17.0 mm Print 3D Model
Weight: 425 g; 337 g
Materials: Rugged Smartphone, Metal; Rugged Smartphone, Polycarbonate
Colors: Black; Black Red Orange
Water/dust resistance: IP68, IP69; IP68, MIL-STD-810G , IP69
Drop resistance: Class A B C D E 270 drops without defects; —
Repairability: Class A B C D E; —
Usable surface: 79 %; 70 %

Operating system: Android 14 Upside-down cake Android 14; Android 11 Red Velvet Cake Android 11
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.2; Bluetooth 5.2 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), LE (Low Energy), LDAC, SBC, AAC
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B26 (850), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), CDMA BC1 (1900), CDMA BC10 (800 Secondary), B2 (1900), B3 (1800), B5 (850), B8 (900)
5G: —; n1 (2100), n3 (1800), n5 (850), n8 (900), n20 (800), n28b (700), n28a (700), n38 (2600), n41 (2500), n77 (3700), n78 (3500), n79 (4700)