Cubot KingKong Power 3 vs hotwav Cyber 15

At a glance

Brand: Cubot; Hotwav
Release date: October 2024, 1 years 7 months ago; May 2024, 2 years ago
AnTuTu: 411.163 Antutu v10 Overall performance better than 68% of devices; 415.300 Antutu v10 Overall performance better than 68% of devices

Size: 6.72"; 6.6"
Resolution: 1080 x 2408 px FHD+; 1080 x 2408 px FHD+
Type: LCD IPS; LCD IPS
Density: 401 ppi Very high density; 396 ppi High Density
Aspect ratio: 20:9; 21:9
Features: Water Drop Notch, Refresh rate 120 Hz, 2.5D curved glass screen, Capacitive, Multi-touch, In-cell; Hole-punch Notch, Refresh rate 90 Hz, 1500:1 contrast ratio, Corning Gorilla Glass, Capacitive, Multi-touch

Chipset: MediaTek Helio G99 (MT6789); MediaTek Helio G99 (MT6789)
CPU: 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz; 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz
CPU type: Octa-Core; Octa-Core
Process: 6 nm; 6 nm
Frequency: 2.2 GHz; 2.2 GHz
GPU: Mali-G57 MC2; Mali-G57 MC2
RAM: 6 GB; 12 GB
RAM type: LPDDR4X RAM; LPDDR4X RAM
64-bit: Yes; Yes

Resolution: 100 Mpx; 200 Mpx
Aperture: Unknow; ƒ/ 1.8
Pixel size: 0.80 µm; —
Flash: LED; Dual LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Triple camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Samsung S5KHP3SP
Sensor size: —; 1/1.4"

Capacity: 256 GB; 256 GB
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 82.7 mm 165.3 mm 20.0 mm Print 3D Model; 82.3 mm 174.6 mm 12.8 mm Print 3D Model
Weight: 425 g; 290 g
Materials: Rugged Smartphone, Metal; TPU , Rugged Smartphone
Colors: Black; Black
Water/dust resistance: IP68, IP69; IP68, MIL-STD-810G , IP69
Drop resistance: Class A B C D E 270 drops without defects; Class A B C D E 270 drops without defects
Repairability: Class A B C D E; Class A B C D E
Usable surface: 79 %; 67 %

Operating system: Android 14 Upside-down cake Android 14; Android 13 Tiramisu Android 13
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.2; Bluetooth 5.1
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B26 (850), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B30 (2300), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100), B71 (600)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)