Cubot Kingkong Mini 4 vs iiif150 B3C

At a glance

Brand: Cubot; iiiF150
Release date: November 2025, 6 months ago; April 2025, 1 years 1 months ago
AnTuTu: 285.000 Antutu v9 Overall performance better than 61% of devices; 251.000 Antutu v10 Overall performance better than 59% of devices

Size: 4.7"; 6.6"
Resolution: 720 x 1600 px HD+; 720 x 1600 px HD+
Type: LCD IPS; LCD IPS
Density: 373 ppi High Density; 266 ppi Medium Density
Aspect ratio: 20:9; 20:9
Features: Hole-punch Notch, Glove touch support, Color LED Notifications, Scratch resistant, Capacitive, Multi-touch; Hole-punch Notch, Refresh rate 90 Hz, Color LED Notifications, Corning Gorilla Glass 3, Capacitive, Multi-touch

Chipset: Unisoc Tiger T616; Unisoc UMS9230
CPU: 2 x ARM Cortex A75 2.0Ghz + 6 x ARM Cortex A55 1.8Ghz; 2 x 1.8 GHz & 6 x 1.8 GHz
CPU type: Octa-Core; Octa-Core
Process: 12 nm; 12 nm
Frequency: 2 GHz; 1.8 GHz
GPU: Mali-G57 MP1; Mali G57 MP1
RAM: 6 GB; 4 GB
RAM type: LPDDR4X RAM; LPDDR4X RAM
64-bit: Yes; Yes

Resolution: 48 Mpx; 50 Mpx
Aperture: ƒ/ 1.8; Unknow
Flash: LED; Triple LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Digital zoom, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacity: 128 GB; 256 GB
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Type: —; UFS Storage 2.2

Dimensions: 61.0 mm 128.7 mm 16.8 mm Print 3D Model; 79.6 mm 168.8 mm 15.8 mm Print 3D Model
Weight: 192 g; 336 g
Materials: Rugged Smartphone, Polycarbonate; TPU , Rugged Smartphone, Polycarbonate , Metal
Colors: Black Red Green Orange; Black Gray
Water/dust resistance: IP68, MIL-STD-810G , IP69; IP68, IP69 , MIL-STD-810H
Drop resistance: Class A B C D E 270 drops without defects; Class A B C D E 270 drops without defects
Repairability: Class A B C D E; Class A B C D E
Usable surface: 68 %; 78 %

Operating system: Android 15 Android 15; Android 14 Upside-down cake Android 14
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.0
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), B2 (1900), B3 (1800), B5 (850), B8 (900)