Cubot Kingkong Mini 4 vs iiif150 Action 15 Pro

At a glance

Brand: Cubot; iiiF150
Release date: November 2025, 6 months ago; October 2025, 7 months ago
AnTuTu: 285.000 Antutu v9 Overall performance better than 61% of devices; 401.000 Antutu v10 Overall performance better than 65% of devices

Size: 4.7"; 6.78"
Resolution: 720 x 1600 px HD+; 1080 x 2400 px FHD+
Type: LCD IPS; AMOLED
Density: 373 ppi High Density; 388 ppi High Density
Aspect ratio: 20:9; 20:9
Features: Hole-punch Notch, Glove touch support, Color LED Notifications, Scratch resistant, Capacitive, Multi-touch; Hole-punch Notch, SGS Certified, Refresh rate 120 Hz, Brightnes 500 cd/m² (typ), 2.5D curved glass screen, Dual Edge display, Capacitive, Multi-touch, Frameless, In-cell

Chipset: Unisoc Tiger T616; MediaTek Helio G100
CPU: 2 x ARM Cortex A75 2.0Ghz + 6 x ARM Cortex A55 1.8Ghz; 2x2.2GHz Cortex A76 + 6x2GHz Cortex A55
CPU type: Octa-Core; Octa-Core
Process: 12 nm; 6 nm
Frequency: 2 GHz; 2.2 GHz
GPU: Mali-G57 MP1; Arm Mali-G57 MC2
RAM: 6 GB; 8 GB
RAM type: LPDDR4X RAM; —
64-bit: Yes; Yes

Resolution: 48 Mpx; 50 Mpx
Aperture: ƒ/ 1.8; ƒ/ 1.9
Flash: LED; LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Digital zoom, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Sony IMX766
Pixel size: —; 1.00 µm
Sensor size: —; 1/1.56"

Dimensions: 61.0 mm 128.7 mm 16.8 mm Print 3D Model; 74.6 mm 164.6 mm 6.9 mm Print 3D Model
Weight: 192 g; 177 g
Materials: Rugged Smartphone, Polycarbonate; Plastic
Colors: Black Red Green Orange; Black White
Water/dust resistance: IP68, MIL-STD-810G , IP69; IP68, IP69 , MIL-STD-810H
Drop resistance: Class A B C D E 270 drops without defects; Class A B C D E 270 drops without defects
Repairability: Class A B C D E; Class A B C D E
Usable surface: 68 %; 90 %

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.0
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Wi-Fi Hotspot, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)