Cubot Kingkong Mini 4 vs hisense A9 Pro

At a glance

Brand: Cubot; HiSense
Release date: November 2025, 8 months ago; March 2023, 3 years 4 months ago
AnTuTu: 285.000 Antutu v9 Overall performance better than 61% of devices; 102.000 Antutu v9 Overall performance better than 51% of devices

Size: 4.7"; 6.1"
Resolution: 720 x 1600 px HD+; 824 x 1648 px FHD
Type: LCD IPS; eInk E INK Carta 1200
Density: 373 ppi High Density; 302 ppi High Density
Aspect ratio: 20:9; 18:9
Features: Hole-punch Notch, Glove touch support, Color LED Notifications, Scratch resistant, Capacitive, Multi-touch; Water Drop Notch, Capacitive, Multi-touch, Frameless

Chipset: Unisoc Tiger T616; Qualcomm Snapdragon 662
CPU: 2 x ARM Cortex A75 2.0Ghz + 6 x ARM Cortex A55 1.8Ghz; 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz
CPU type: Octa-Core; Octa-Core
Process: 12 nm; 11 nm
Frequency: 2 GHz; 2 GHz
GPU: Mali-G57 MP1; Qualcomm Adreno 610
RAM: 6 GB; 8 GB
RAM type: LPDDR4X RAM; —
64-bit: Yes; Yes

Resolution: 48 Mpx; 13 Mpx
Aperture: ƒ/ 1.8; Unknow
Flash: LED; LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Digital zoom, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacity: 128 GB; 256 GB
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 61.0 mm 128.7 mm 16.8 mm Print 3D Model; 79.5 mm 159.0 mm 7.8 mm Print 3D Model
Weight: 192 g; 183 g
Materials: Rugged Smartphone, Polycarbonate; Plastic
Colors: Black Red Green Orange; Black
Water/dust resistance: IP68, MIL-STD-810G , IP69; —
Drop resistance: Class A B C D E 270 drops without defects; —
Repairability: Class A B C D E; —
Usable surface: 68 %; 76 %

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.1
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)