Cubot Kingkong Mini 4 vs Doogee Fire 7

At a glance

Brand: Cubot; Doogee
Release date: November 2025, 6 months ago; August 2025, 9 months ago
AnTuTu: 285.000 Antutu v9 Overall performance better than 61% of devices; 405.000 Antutu v10 Overall performance better than 66% of devices

Size: 4.7"; 6.6"
Resolution: 720 x 1600 px HD+; 720 x 1612 px HD+
Type: LCD IPS; LCD IPS
Density: 373 ppi High Density; 267 ppi Medium Density
Aspect ratio: 20:9; 20:9
Features: Hole-punch Notch, Glove touch support, Color LED Notifications, Scratch resistant, Capacitive, Multi-touch; Water Drop Notch, Refresh rate 90 Hz, Corning Gorilla Glass, Capacitive, Multi-touch

Chipset: Unisoc Tiger T616; MediaTek Dimensity 6300
CPU: 2 x ARM Cortex A75 2.0Ghz + 6 x ARM Cortex A55 1.8Ghz; 2x2.4 GHz ARM Cortex A76 +6x2.0 GHz ARM Cortex A55
CPU type: Octa-Core; Octa-Core
Process: 12 nm; 6 nm
Frequency: 2 GHz; 2.4 GHz
GPU: Mali-G57 MP1; Arm Mali-G57 MC2
RAM: 6 GB; 4 GB
RAM type: LPDDR4X RAM; LPDDR4X RAM
64-bit: Yes; Yes

Resolution: 48 Mpx; 64 Mpx
Aperture: ƒ/ 1.8; ƒ/ 1.79
Flash: LED; LED
Optical stabilization: No; No
Slow motion: No, 30 fps; Yes, 120 fps
Features: Digital zoom, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Sony IMX682 Exmor RS
Pixel size: —; 0.80 µm
Sensor size: —; 1/1.7"

Dimensions: 61.0 mm 128.7 mm 16.8 mm Print 3D Model; 82.5 mm 176.5 mm 18.7 mm Print 3D Model
Weight: 192 g; 389 g
Materials: Rugged Smartphone, Polycarbonate; Rugged Smartphone, Polycarbonate
Colors: Black Red Green Orange; Black Gray Green Orange
Water/dust resistance: IP68, MIL-STD-810G , IP69; IP68, IP69 , MIL-STD-810H
Drop resistance: Class A B C D E 270 drops without defects; Class A B C D E 270 drops without defects
Repairability: Class A B C D E; Class A B C D E
Usable surface: 68 %; 71 %

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.2 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), CDMA BC1 (1900), B2 (1900), B3 (1800), B5 (850), B8 (900)
5G: —; n1 (2100), n3 (1800), n5 (850), n7 (2600), n8 (900), n20 (800), n28b (700), n28a (700), n41 (2500), n42 (3500), n77 (3700), n78 (3500)