Cubot KingKong ES vs fossibot F105

At a glance

Brand: Cubot; Fossibot
Release date: August 2024, 1 years 9 months ago; July 2024, 1 years 10 months ago
AnTuTu: 225.000 Antutu v10 Overall performance better than 56% of devices; 92.000 Antutu v9 Overall performance better than 50% of devices

Size: 6.56"; 6.74"
Resolution: 720 x 1612 px HD+; 720 x 1600 px HD+
Type: LCD IPS; TFT LCD (IPS)
Density: 269 ppi Medium Density; 260 ppi Medium Density
Aspect ratio: 20:9; 20:9
Features: Water Drop Notch, Refresh rate 90 Hz, 2.5D curved glass screen, Capacitive, Multi-touch, In-cell; Water Drop Notch, Refresh rate 120 Hz, Brightnes 450 cd/m² (typ), 1500:1 contrast ratio, Scratch resistant, Dragontrail glass, Corning Gorilla Glass 5, Capacitive, Multi-touch

Chipset: Unisoc Tiger T606; MediaTek MT8768
CPU: 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55; 4x Cortex A53 2.3 GHz + 4x Cortex A53 1.8 GHz
CPU type: Octa-Core; Octa-Core
Process: 12 nm; 12 nm
Frequency: 1.6 GHz; 2.3 GHz
GPU: ARM Mali-G57; PowerVR GE8300
RAM: 6 GB; 4 GB
RAM type: LPDDR4X RAM; LPDDR4X RAM
64-bit: Yes; Yes

Resolution: 48 Mpx; 13 Mpx
Aperture: Unknow; ƒ/ 2.2
Flash: Dual LED; Dual LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Geotagging, HDR, Scene mode, Self-timer; Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer, Night Mode, Night Vision
Sensor: —; Hynix Hi-1333
Pixel size: —; 1.12 µm
Sensor size: —; 1/3"

Capacity: 128 GB; 64 GB
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 81.2 mm 172.6 mm 12.8 mm Print 3D Model; 84.0 mm 177.7 mm 17.3 mm Print 3D Model
Weight: 268 g; 375 g
Materials: Rugged Smartphone, Metal; Rugged Smartphone, Polycarbonate , Corning Gorilla Glass
Colors: Black Orange; Black Blue Green
Water/dust resistance: IP68, IP69; IP68, IP69 , MIL-STD-810H
Drop resistance: Class A B C D E 270 drops without defects; Class A B C D E 270 drops without defects
Repairability: Class A B C D E; Class A B C D E
Usable surface: 73 %; 51 %

Operating system: Android 14 Upside-down cake Android 14; Android 14 Upside-down cake Android 14
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0; Bluetooth 5.0 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)