Cubot KingKong ACE 3 vs hotwav Cyber 13

At a glance

Brand: Cubot; Hotwav
Release date: June 2024, 1 years 11 months ago; December 2024, 1 years 5 months ago
AnTuTu: 250.000 Antutu v10 Overall performance better than 59% of devices; 235.000 Antutu v10 Overall performance better than 57% of devices

Size: 6.58"; 6.6"
Resolution: 1080 x 2408 px FHD+; 720 x 1612 px HD+
Type: LCD IPS; LCD IPS
Density: 401 ppi Very high density; 267 ppi Medium Density
Aspect ratio: 20:9; 20:9
Features: Water Drop Notch, Refresh rate 120 Hz, Capacitive, Multi-touch; Water Drop Notch, Brightnes 400 cd/m² (typ), Max brightness HBM - 500 cd/m², 2.5D curved glass screen, Panda glass, Capacitive, Multi-touch

Chipset: MediaTek Helio G88; Unisoc Tiger T606
CPU: 2x Cortex A75 2.0 GHz + 6x Cortex A55 1.8 GHz; 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55
CPU type: Octa-Core; Octa-Core
Process: 12 nm; 12 nm
Frequency: 2 GHz; 1.6 GHz
GPU: Arm Mali-G52 MC2 1000MHz; ARM Mali-G57
RAM: 8 GB; 8 GB
64-bit: Yes; Yes
RAM type: —; LPDDR4X RAM

Resolution: 100 Mpx; 64 Mpx
Aperture: ƒ/ 1.89; ƒ/ 1.8
Sensor: Omnivision OVA0B40; Omnivision OV64B
Pixel size: 0.61 µm; 0.70 µm
Sensor size: 1/1.8"; 1/2"
Flash: Dual LED; LED
Optical stabilization: No; No
Slow motion: Yes, 120 fps; No, 30 fps
Features: 4K Video, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Geotagging, Panorama, HDR, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacity: 256 GB; 128 GB
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Type: —; UFS Storage 2.2

Dimensions: 81.8 mm 173.9 mm 12.7 mm Print 3D Model; 84.2 mm 176.8 mm 16.8 mm Print 3D Model
Weight: 284 g; 388 g
Materials: TPU , Rugged Smartphone; Rugged Smartphone, Plastic
Colors: Orange; Black Orange
Water/dust resistance: IP68, IP69 , MIL-STD-810H; —
Usable surface: 74 %; 82 %
Drop resistance: —; Class A B C D E 76 drops without defects
Repairability: —; Class A B C D E

Operating system: Android 14 Upside-down cake Android 14; Android 14 Upside-down cake Android 14
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.1 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display, Wi-Fi MiMO; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo
USB: —; USB Type-C

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), B2 (1900), B3 (1800), B5 (850), B8 (900)