Cubot KingKong ACE 2 vs hotwav W11

At a glance

Brand: Cubot; Hotwav
Release date: November 2024, 1 years 6 months ago; March 2024, 2 years 2 months ago
AnTuTu: 221.000 Antutu v10 Overall performance better than 56% of devices; 260.000 Antutu v10 Overall performance better than 60% of devices

Size: 6.56"; 6.6"
Resolution: 720 x 1612 px HD+; 1080 x 2460 px FHD+
Type: LCD IPS; LCD IPS
Density: 401 ppi Very high density; 407 ppi Very high density
Aspect ratio: 20:9; 20:9
Features: Water Drop Notch, Refresh rate 120 Hz, Capacitive, Multi-touch; Hole-punch Notch, Brightnes 380 cd/m² (typ), 1000:1 contrast ratio, 1500:1 contrast ratio, Scratch resistant, Corning Gorilla Glass, Capacitive, Multi-touch

Chipset: MediaTek Helio G85 (MT6769V/CZ); MediaTek MT8788V
CPU: 2x Cortex A75 2.0 GHz + 6x Cortex A55 1.8 GHz; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
CPU type: Octa-Core; Octa-Core
Process: 12 nm; 12 nm
Frequency: 2 GHz; 2 GHz
GPU: Arm Mali-G52 MC2 950MHz; Mali-G72 MP3
RAM: 6 GB; 6 GB
64-bit: Yes; Yes
RAM type: —; LPDDR4X RAM

Resolution: 48 Mpx; 64 Mpx
Aperture: ƒ/ 1.89; ƒ/ 1.8
Pixel size: 0.61 µm; 0.80 µm
Flash: Dual LED; Dual LED
Optical stabilization: No; No
Slow motion: Yes, 120 fps; No, 30 fps
Features: 4K Video, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Geotagging, Panorama, HDR, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Sony IMX686 Exmor RS
Sensor size: —; 1/1.7"

Capacity: 128 GB; 256 GB
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Type: —; UFS Storage 2.1

Dimensions: 81.8 mm 173.9 mm 12.7 mm Print 3D Model; 84.8 mm 176.6 mm 26.5 mm Print 3D Model
Weight: 283 g; 563 g
Materials: TPU , Rugged Smartphone; Rugged Smartphone, Polycarbonate
Colors: Green Orange; Gray Orange
Water/dust resistance: IP68, IP69 , MIL-STD-810H; IP68, MIL-STD-810G , IP69
Drop resistance: Class A B C D E 270 drops without defects; —
Repairability: Class A B C D E; —
Usable surface: 74 %; 70 %

Operating system: Android 14 Upside-down cake Android 14; Android 13 Tiramisu Android 13
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 4.2 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), LE (Low Energy), LDAC, SBC, AAC
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display, Wi-Fi MiMO; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo
USB: —; USB Type-C

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900); B1 (2100), B2 (1900), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), CDMA BC1 (1900), CDMA BC10 (800 Secondary), B2 (1900), B3 (1800), B5 (850), B8 (900)