Cubot KingKong ACE 2 vs hotwav Cyber 13

At a glance

Brand: Cubot; Hotwav
Release date: November 2024, 1 years 6 months ago; December 2024, 1 years 5 months ago
AnTuTu: 221.000 Antutu v10 Overall performance better than 56% of devices; 235.000 Antutu v10 Overall performance better than 57% of devices

Size: 6.56"; 6.6"
Resolution: 720 x 1612 px HD+; 720 x 1612 px HD+
Type: LCD IPS; LCD IPS
Density: 401 ppi Very high density; 267 ppi Medium Density
Aspect ratio: 20:9; 20:9
Features: Water Drop Notch, Refresh rate 120 Hz, Capacitive, Multi-touch; Water Drop Notch, Brightnes 400 cd/m² (typ), Max brightness HBM - 500 cd/m², 2.5D curved glass screen, Panda glass, Capacitive, Multi-touch

Chipset: MediaTek Helio G85 (MT6769V/CZ); Unisoc Tiger T606
CPU: 2x Cortex A75 2.0 GHz + 6x Cortex A55 1.8 GHz; 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55
CPU type: Octa-Core; Octa-Core
Process: 12 nm; 12 nm
Frequency: 2 GHz; 1.6 GHz
GPU: Arm Mali-G52 MC2 950MHz; ARM Mali-G57
RAM: 6 GB; 8 GB
64-bit: Yes; Yes
RAM type: —; LPDDR4X RAM

Resolution: 48 Mpx; 64 Mpx
Aperture: ƒ/ 1.89; ƒ/ 1.8
Pixel size: 0.61 µm; 0.70 µm
Flash: Dual LED; LED
Optical stabilization: No; No
Slow motion: Yes, 120 fps; No, 30 fps
Features: 4K Video, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Geotagging, Panorama, HDR, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Omnivision OV64B
Sensor size: —; 1/2"

Capacity: 128 GB; 128 GB
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Type: —; UFS Storage 2.2

Dimensions: 81.8 mm 173.9 mm 12.7 mm Print 3D Model; 84.2 mm 176.8 mm 16.8 mm Print 3D Model
Weight: 283 g; 388 g
Materials: TPU , Rugged Smartphone; Rugged Smartphone, Plastic
Colors: Green Orange; Black Orange
Water/dust resistance: IP68, IP69 , MIL-STD-810H; —
Drop resistance: Class A B C D E 270 drops without defects; Class A B C D E 76 drops without defects
Repairability: Class A B C D E; Class A B C D E
Usable surface: 74 %; 82 %

Operating system: Android 14 Upside-down cake Android 14; Android 14 Upside-down cake Android 14
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.1 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display, Wi-Fi MiMO; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo
USB: —; USB Type-C

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), B2 (1900), B3 (1800), B5 (850), B8 (900)