Cubot KingKong 9 vs hisense E60 Lite

At a glance

Brand: Cubot; HiSense
Release date: May 2023, 3 years 1 months ago; April 2022, 4 years 2 months ago
AnTuTu: 416.900 Antutu v10 Overall performance better than 68% of devices; 121.300 Antutu v9 Overall performance better than 52% of devices

Size: 6.58"; 6.52"
Resolution: 1080 x 2408 px FHD+; 720 x 1600 px HD+
Type: LCD IPS; LCD IPS
Density: 401 ppi Very high density; 269 ppi Medium Density
Aspect ratio: 20:9; 21:9
Features: Water Drop Notch, Refresh rate 120 Hz, 2.5D curved glass screen, Capacitive, Multi-touch, In-cell; Water Drop Notch, Capacitive, Multi-touch, Frameless

Chipset: MediaTek Helio G99 (MT6789); Spreadtrum Unisoc SC9863A
CPU: 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz; 4x Cortex A55 1.6 GHz + 4x Cortex A55 1.2 GHz
CPU type: Octa-Core; Octa-Core
Process: 6 nm; 28 nm
Frequency: 2.2 GHz; 1.6 GHz
GPU: Mali-G57 MC2; PowerVR GE8322
RAM: 12 GB; 2 GB
RAM type: LPDDR4X RAM; —
64-bit: Yes; Yes

Resolution: 100 Mpx; 13 Mpx
Aperture: Unknow; Unknow
Pixel size: 0.80 µm; —
Flash: Dual LED; Dual LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Triple camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Scene mode, Self-timer, Night Vision; Digital zoom, Triple camera, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacity: 256 GB; 64 GB
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 81.6 mm 172.0 mm 17.7 mm Print 3D Model; 76.7 mm 166.0 mm 9.7 mm Print 3D Model
Weight: 390 g; 199 g
Materials: Rugged Smartphone, Metal; Plastic
Colors: Black; Blue Gray
Water/dust resistance: IP68, IP69; —
Drop resistance: Class A B C D E 270 drops without defects; —
Repairability: Class A B C D E; —
Usable surface: 74 %; 80 %

Operating system: Android 13 Tiramisu Android 13; Android 11 Red Velvet Cake Android 11 Go edition
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.2; Bluetooth 4.2
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11b , 802.11g , 802.11n , 802.11n 5GHz
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B26 (850), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B12 (700), B26 (850), B28b (700), B28a (700)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)