Cubot A10 vs hotwav Note 12 2024

At a glance

Brand: Cubot; Hotwav
Release date: May 2024, 2 years ago; October 2024, 1 years 7 months ago
AnTuTu: 221.000 Antutu v10 Overall performance better than 56% of devices; 256.000 Antutu v10 Overall performance better than 60% of devices

Size: 6.56"; 6.8"
Resolution: 720 x 1612 px HD+; 720 x 1640 px HD+
Type: LCD IPS; LCD IPS
Density: 269 ppi Medium Density; 409 ppi Very high density
Aspect ratio: 20:9; 19.5:9
Features: Water Drop Notch, Refresh rate 90 Hz, 2.5D curved glass screen, Capacitive, Multi-touch; Hole-punch Notch, Refresh rate 90 Hz, Max brightness HBM - 500 cd/m², 1000:1 contrast ratio, 1500:1 contrast ratio, Scratch resistant, Corning Gorilla Glass, Panda glass, Capacitive, Multi-touch

Chipset: Unisoc Tiger T606; Unisoc Tiger T606
CPU: 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55; 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55
CPU type: Octa-Core; Octa-Core
Process: 12 nm; 12 nm
Frequency: 1.6 GHz; 1.6 GHz
GPU: ARM Mali-G57; ARM Mali-G57
RAM: 4 GB; 6 GB
64-bit: Yes; Yes
RAM type: —; LPDDR4X RAM

Resolution: 48 Mpx; 48 Mpx
Aperture: Unknow; ƒ/ 1.8
Flash: Dual LED; LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, HDR, Face detection, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Omnivision OV48B
Pixel size: —; 0.80 µm
Sensor size: —; 1/2"

Capacity: 128 GB; 128 GB
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Type: —; UFS Storage 2.2

Dimensions: 75.5 mm 165.6 mm 10.4 mm Print 3D Model; 78.0 mm 173.0 mm 8.9 mm Print 3D Model
Weight: 200 g; 220 g
Materials: Polycarbonate; Rugged Smartphone, Polycarbonate
Colors: Black Blue Purple; Black Purple Green
Drop resistance: Class A B C D E 270 drops without defects; Class A B C D E 270 drops without defects
Repairability: Class A B C D E; Class A B C D E
Usable surface: 82 %; 70 %

Operating system: Android 14 Upside-down cake Android 14; Android 14 Upside-down cake Android 14
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0; Bluetooth 5.0 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), LE (Low Energy), LDAC, SBC, AAC
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B20 (800), B28b (700), B28a (700), B41 (TDD 2500); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), CDMA BC1 (1900), CDMA BC10 (800 Secondary), B2 (1900), B3 (1800), B5 (850), B8 (900)