Cubot A1 vs hotwav Hyper 7S

At a glance

Brand: Cubot; Hotwav
Release date: April 2024, 2 years 2 months ago; August 2025, 10 months ago
AnTuTu: 115.000 Antutu v9 Overall performance better than 52% of devices; 402.000 Antutu v10 Overall performance better than 66% of devices

Size: 6.5"; 6.6"
Resolution: 720 x 1600 px HD+; 1080 x 2460 px FHD+
Type: LCD IPS; AMOLED
Density: 270 ppi Medium Density; 407 ppi Very high density
Aspect ratio: 20:9; 21:9
Features: Water Drop Notch, 2.5D curved glass screen, Capacitive, Multi-touch; Water Drop Notch, Refresh rate 120 Hz, Brightnes 500 cd/m² (typ), Max brightness HBM - 550 cd/m², Peak brightness - 2600 cd/m², DCI-P3, Corning Gorilla Glass 3, Capacitive, Multi-touch

Chipset: Spreadtrum Unisoc SC9863A; Unisoc Tiger T765 (T8200)
CPU: 4x Cortex A55 1.6 GHz + 4x Cortex A55 1.2 GHz; 2x2.3 GHz ARM Cortex A76+6x 2.1 GHz ARM Cortex A55
CPU type: Octa-Core; Octa-Core
Process: 28 nm; 6 nm
Frequency: 1.6 GHz; 2.3 GHz
GPU: PowerVR GE8322; ARM Mali-G57 MC2
RAM: 4 GB; 4 GB
64-bit: Yes; Yes
RAM type: —; RAM LPDDR5

Resolution: 13 Mpx; 20.7 Mpx
Aperture: Unknow; ƒ/ 2.2
Flash: LED; Dual LED
Optical stabilization: No; No
Slow motion: No, 30 fps; Yes, 120 fps
Features: Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Sony IMX220 Exmor RS
Pixel size: —; 1.20 µm
Sensor size: —; 1/2.3"

Dimensions: 75.5 mm 165.7 mm 10.5 mm Print 3D Model; 82.7 mm 178.0 mm 19.1 mm Print 3D Model
Weight: 205 g; 395 g
Materials: Polycarbonate; TPU , Rugged Smartphone
Colors: Black Cyan; Yellow Gray
Usable surface: 81 %; 73 %
Water/dust resistance: —; IP68, IP69 , MIL-STD-810H
Drop resistance: —; Class A B C D E 270 drops without defects
Repairability: —; Class A B C D E

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 4.2; Bluetooth 5.2
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11b , 802.11g , 802.11n; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), B2 (1900), B3 (1800), B5 (850), B8 (900)
5G: —; n1 (2100), n2 (1900 PCS), n7 (2600), n8 (900), n20 (800), n28b (700), n28a (700), n38 (2600), n40 (2300), n41 (2500), n66 (1700), n77 (3700), n78 (3500)