coolpad X100 vs hotwav Cyber 15

At a glance

Brand: Coolpad; Hotwav
Release date: May 2025, 1 years 1 months ago; May 2024, 2 years 1 months ago
AnTuTu: 416.900 Antutu v10 Overall performance better than 68% of devices; 415.300 Antutu v10 Overall performance better than 68% of devices

Size: 6.78"; 6.6"
Resolution: 1080 x 2460 px FHD+; 1080 x 2408 px FHD+
Type: LCD IPS; LCD IPS
Density: 396 ppi High Density; 396 ppi High Density
Aspect ratio: 20:9; 21:9
Features: Hole-punch Notch, Refresh rate 120 Hz, Brightnes 450 cd/m² (typ), DCI-P3, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless; Hole-punch Notch, Refresh rate 90 Hz, 1500:1 contrast ratio, Corning Gorilla Glass, Capacitive, Multi-touch

Chipset: MediaTek Helio G99 (MT6789); MediaTek Helio G99 (MT6789)
CPU: 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz; 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz
CPU type: Octa-Core; Octa-Core
Process: 6 nm; 6 nm
Frequency: 2.2 GHz; 2.2 GHz
GPU: Mali-G57 MC2; Mali-G57 MC2
RAM: 8 GB; 12 GB
RAM type: LPDDR4X RAM; LPDDR4X RAM
64-bit: Yes; Yes

Resolution: 108 Mpx; 200 Mpx
Aperture: ƒ/ 1.69; ƒ/ 1.8
Flash: LED; Dual LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Geotagging, Panorama, HDR, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Samsung S5KHP3SP
Sensor size: —; 1/1.4"

Dimensions: 76.3 mm 169.0 mm 8.8 mm Print 3D Model; 82.3 mm 174.6 mm 12.8 mm Print 3D Model
Weight: 213 g; 290 g
Materials: Polycarbonate; TPU , Rugged Smartphone
Colors: Black Blue Silver Pink; Black
Water/dust resistance: IP54; IP68, MIL-STD-810G , IP69
Usable surface: 84 %; 67 %
Drop resistance: —; Class A B C D E 270 drops without defects
Repairability: —; Class A B C D E

Operating system: Android 14 Upside-down cake Android 14; Android 13 Tiramisu Android 13
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 6.0; Bluetooth 5.1
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display, Wi-Fi MiMO; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B30 (2300), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100), B71 (600)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)