coolpad C15 vs Cubot KingKong 11

At a glance

Brand: Coolpad; Cubot
Release date: May 2024, 2 years ago; July 2025, 10 months ago
AnTuTu: 127.000 Antutu v9 Overall performance better than 53% of devices; 470.000 Antutu v10 Overall performance better than 72% of devices

Size: 6.56"; 6.72"
Resolution: 720 x 1612 px HD+; 1080 x 2400 px FHD+
Type: LCD IPS; LCD IPS
Density: 269 ppi Medium Density; 400 ppi Very high density
Aspect ratio: 20:9; 20:9
Features: Water Drop Notch, Refresh rate 90 Hz, Touch sampling rate 180 Hz, Brightnes 400 cd/m² (typ), 1500:1 contrast ratio, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless; Water Drop Notch, Secondary rear display, Refresh rate 120 Hz, Corning Gorilla Glass, Capacitive, Multi-touch

Chipset: Mediatek Helio G36; MediaTek Dimensity 7025
CPU: 8x Cortex A53 2.2 GHz; 2x2.5 GHz ARM Cortex A78+6x 2.0 GHz ARM Cortex A55
CPU type: Octa-Core; Octa-Core
Process: 12 nm; 6 nm
Frequency: 2.2 GHz; 2.5 GHz
GPU: IMG PowerVR GE8320 680 MHz; IMG BXM-8-256
RAM: 4 GB; 16 GB
RAM type: LPDDR4X RAM; RAM LPDDR5
64-bit: Yes; Yes

Resolution: 50 Mpx; 108 Mpx
Aperture: ƒ/ 1.8; ƒ/ 1.89
Flash: Hexa Led; Dual LED
Optical stabilization: No; No
Slow motion: No, 30 fps; Yes, 120 fps
Features: Digital zoom, Dual camera, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer, Front Flash; 4K Video, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Geotagging, Panorama, HDR, Scene mode, Self-timer, Night Vision
Sensor: —; Samsung HM6
Pixel size: —; 0.61 µm
Sensor size: —; 1/1.67"

Capacity: 128 GB; 256 GB
Type: eMMC 5.1 Storage; UFS Storage 3.1
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 75.7 mm 164.2 mm 8.8 mm Print 3D Model; 84.1 mm 176.0 mm 18.7 mm Print 3D Model
Weight: 196 g; 388 g
Materials: Plastic; TPU , Rugged Smartphone
Colors: Black Blue Purple; Black
Usable surface: 83 %; 73 %
Water/dust resistance: —; IP68, IP69 , MIL-STD-810H
Drop resistance: —; Class A B C D E 90 drops without defects
Repairability: —; Class A B C D E

Operating system: Android 14 Upside-down cake Android 14; Android 14 Upside-down cake Android 14
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.1 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Display; Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display, Wi-Fi MiMO
USB: USB Type-C; —
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100), B71 (600)
3G: B1 (2100), B2 (1900), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: CDMA BC0 (800), B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)
5G: —; n1 (2100), n3 (1800), n5 (850), n7 (2600), n8 (900), n20 (800), n25 (1900), n28b (700), n28a (700), n38 (2600), n40 (2300), n41 (2500), n66 (1700), n77 (3700), n78 (3500)