Blackview BV4800 SE vs hotwav Note 16

At a glance

Brand: Blackview; Hotwav
Release date: February 2025, 1 years 3 months ago; September 2025, 8 months ago
AnTuTu: 298.000 Antutu v9 Overall performance better than 61% of devices; 235.000 Antutu v10 Overall performance better than 57% of devices

Size: 6.56"; 6.9"
Resolution: 720 x 1612 px HD+; 720 x 1640 px HD+
Type: LCD IPS; LCD IPS
Density: 269 ppi Medium Density; 260 ppi Medium Density
Aspect ratio: 20:9; 20:9
Features: Water Drop Notch, Scratch resistant, Dragontrail glass, Corning Gorilla Glass 5, Capacitive, Multi-touch; Water Drop Notch, Brightnes 450 cd/m² (typ), Max brightness HBM - 500 cd/m², 2.5D curved glass screen, Panda glass, Capacitive, Multi-touch

Chipset: Unisoc Tiger T615 (T7250); Unisoc Tiger T606
CPU: 2 x ARM Cortex A75 1.8Ghz + 6 x ARM Cortex A55 1.6Ghz; 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55
CPU type: Octa-Core; Octa-Core
Process: 12 nm; 12 nm
Frequency: 1.8 GHz; 1.6 GHz
GPU: Mali-G57 MP1; ARM Mali-G57
RAM: 4 GB; 4 GB
RAM type: LPDDR4X RAM; LPDDR4X RAM
64-bit: Yes; Yes

Resolution: 16 Mpx; 13 Mpx
Aperture: ƒ/ 2.2; ƒ/ 1.8
Flash: LED; LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Digital zoom, Dual camera, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Dimensions: 81.5 mm 174.7 mm 13.5 mm Print 3D Model; 78.3 mm 171.8 mm 8.2 mm Print 3D Model
Weight: 285 g; 208 g
Materials: Rugged Smartphone, Polycarbonate; Plastic
Colors: Black Yellow Green Orange; Black Blue Gold
Water/dust resistance: IP68, MIL-STD-810G; —
Drop resistance: Class A B C D E 281 drops without defects; Class A B C D E 57 drops without defects
Repairability: Class A B C D E; Class A B C D E
Usable surface: 72 %; 82 %

Operating system: Android 14 Upside-down cake Doke OS4.0 (Android 14); Android 14 Upside-down cake Android 14
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0; Bluetooth 5.0 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B40 (TDD 2300); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B2 (1900), B8 (900); B1 (2100), B2 (1900), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)