Blackview A55 vs hisense A9 Pro

Blackview A55
Blackview
A55
hisense A9 Pro
hisense
A9 Pro

At a glance

Brand
Blackview
HiSense
Release date
December 2021, 4 years 5 months ago
March 2023, 3 years 2 months ago
AnTuTu
61.000 Antutu v8 Overall performance better than 50% of devices
102.000 Antutu v9 Overall performance better than 51% of devices

Display

Size
6.53"
6.1"
Resolution
720 x 1600 px HD+
824 x 1648 px FHD
Type
LCD IPS
eInk E INK Carta 1200
Density
269 ppi Medium Density
302 ppi High Density
Aspect ratio
20:9
18:9
Features
Water Drop Notch, 2.5D curved glass screen, Capacitive, Multi-touch, In-cell
Water Drop Notch, Capacitive, Multi-touch, Frameless

Performance

Chipset
MediaTek Helio A22 (MT6761V/WE)
Qualcomm Snapdragon 662
CPU
4x Cortex A53 2.0 GHz
4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz
CPU type
Quad-Core
Octa-Core
Process
12 nm
11 nm
Frequency
2 GHz
2 GHz
GPU
IMG PowerVR GE8300
Qualcomm Adreno 610
RAM
3 GB
8 GB
64-bit
Yes
Yes

Rear camera

Resolution
8 Mpx
13 Mpx
Aperture
ƒ/ 2.2
Unknow
Sensor
Sony IMX319 Exmor RS
Pixel size
1.40 µm
Sensor size
1/3.2"
Flash
LED
LED
Optical stabilization
No
No
Slow motion
No, 30 fps
No, 30 fps
Features
Digital zoom, Triple camera, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Front camera

Resolution
5 Mpx
5 Mpx
Aperture
ƒ/ 2.2
ƒ/ 2.0
Sensor
GalaxyCore GC5025
Pixel size
1.12 µm

Battery

Capacity
4780 mAh
4000 mAh
Type
Li-Polymer
Li-Ion
Fast charge
Yes , 5.0W
No
Features
Non-removable
Non-removable

Storage

Capacity
16 GB
256 GB
SD slot
Yes , Independent SD slot
Yes , Slot for SD or second SIM card

Body

Dimensions
76.7 mm 164.5 mm 9.1 mm Print 3D Model
79.5 mm 159.0 mm 7.8 mm Print 3D Model
Weight
196 g
183 g
Materials
Plastic
Plastic
Colors
Black Green Violet
Black
Usable surface
81 %
76 %

Software

Operating system
Android 11 Red Velvet Cake Doke OS 2.0 (Android 11)
Android 12 Snow Cone Android 12
Google services
With Google Mobile Services
With Google Mobile Services

Connectivity

SIM
Dual SIM Dual Standby (Nano SIM + Nano SIM)
Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth
Bluetooth 4.2
Bluetooth 5.1
Bluetooth profiles
A2DP (Advanced Audio Distribution Profile)
A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC
Wi-Fi
802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features
Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
Dual band, Wi-Fi Hotspot
USB features
Charging, OTG
Charging, OTG
Navigation
GPS, A-GPS, GLONASS, Beidou
GPS, A-GPS
USB
USB Type-C

Networks

4G LTE
B1 (2100), B3 (1800), B7 (2600), B8 (900), B20 (800)
B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G
B1 (2100), B8 (900)
B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G
B2 (1900), B3 (1800), B5 (850), B8 (900)
B2 (1900), B3 (1800), B5 (850), B8 (900)

Sensors & security

Fingerprint
No
Yes, on the side
Accelerometer
Yes
Yes
Proximity
Yes
Yes
Light sensor
Yes
Yes
Cooling system
No
No
Audio
Stereo Speakers

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Compared with hisense A9 Pro

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    8 GB · 6.1" · Qualcomm Snapdragon 662
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  • hisense
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  • hisense
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