agm H Max vs hisense A9 Pro

At a glance

Brand: AGM; HiSense
Release date: January 2025, 1 years 5 months ago; March 2023, 3 years 3 months ago
AnTuTu: 265.800 Antutu v10 Overall performance better than 60% of devices; 102.000 Antutu v9 Overall performance better than 51% of devices

Size: 6.56"; 6.1"
Resolution: 720 x 1612 px HD+; 824 x 1648 px FHD
Type: LCD IPS; eInk E INK Carta 1200
Density: 269 ppi Medium Density; 302 ppi High Density
Aspect ratio: 20:9; 18:9
Features: Water Drop Notch, Refresh rate 90 Hz, Brightnes 500 cd/m² (typ), 1500:1 contrast ratio, Scratch resistant, Panda glass, Capacitive, Multi-touch, In-cell; Water Drop Notch, Capacitive, Multi-touch, Frameless

Chipset: Unisoc Tiger T606; Qualcomm Snapdragon 662
CPU: 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55; 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz
CPU type: Octa-Core; Octa-Core
Process: 12 nm; 11 nm
Frequency: 1.6 GHz; 2 GHz
GPU: ARM Mali-G57; Qualcomm Adreno 610
RAM: 4 GB; 8 GB
RAM type: LPDDR4X RAM; —
64-bit: Yes; Yes

Resolution: 13 Mpx; 13 Mpx
Aperture: ƒ/ 2.0; Unknow
Sensor: Samsung S5K3L6; —
Pixel size: 0.80 µm; —
Sensor size: 1/3.1"; —
Flash: LED; LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Digital zoom, Dual camera, Autofocus, Touch focus, Continuous shooting, Panorama, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer, Night Vision; Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Dimensions: 79.6 mm 172.5 mm 15.6 mm Print 3D Model; 79.5 mm 159.0 mm 7.8 mm Print 3D Model
Weight: 324 g; 183 g
Materials: Rugged Smartphone, Polycarbonate; Plastic
Colors: Black; Black
Water/dust resistance: IP68, IP69 , MIL-STD-810H; —
Usable surface: 78 %; 76 %

Operating system: Android 14 Upside-down cake Android 14; Android 12 Snow Cone Android 12
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0; Bluetooth 5.1
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Galileo; GPS, A-GPS

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)