hisense A9 Pro vs iiif150 Action A5 Pro

Übersicht

Marke: HiSense; iiiF150
Erscheinungsdatum: März 2023, vor 3 Jahren und 4 Monaten; Juni 2025, vor 1 Jahren und 1 Monaten
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 239.545 Antutu v10 Overall performance better than 57% of devices

Größe: 6.1"; 6.88"
Auflösung: 824 x 1648 px FHD; 720 x 1640 px HD+
Typ: eInk E INK Carta 1200; LCD IPS
Pixeldichte: 302 ppi High Density; 260 ppi Medium Density
Seitenverhältnis: 18:9; 21:9
Funktionen: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, Brightnes 500 cd/m² (typ), 2.5D curved glass screen, Capacitive, Multi-touch, Frameless, In-cell

Chipsatz: Qualcomm Snapdragon 662; Unisoc Tiger T603
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2xCortex A75 1.8GHz + 6x Cortex A55 1.6GHz
CPU-Typ: Octa-Core; Octa-Core
Fertigung: 11 nm; 12 nm
Taktfrequenz: 2 GHz; 1.8 GHz
GPU: Qualcomm Adreno 610; Mali-G57 MP1
Arbeitsspeicher: 8 GB; 3 GB
64-Bit: Yes; Yes

Auflösung: 13 Mpx; 16 Mpx
Blende: Unknow; ƒ/ 1.8
Blitz: LED; LED
Optische Stabilisierung: No; No
Zeitlupe: No, 30 fps; No, 30 fps
Funktionen: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Kapazität: 256 GB; 256 GB
SD-Slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Abmessungen: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 78.3 mm 172.6 mm 8.2 mm Print 3D Model
Gewicht: 183 g; 207 g
Materialien: Plastic; Plastic
Farben: Black; Black Blue Green Violet Pearl Titanium
Nutzbare Fläche: 76 %; 83 %
Wasser-/Staubschutz: —; IP68, IP69 , MIL-STD-810H

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 4.2
Bluetooth-Profile: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11b , 802.11g , 802.11n
Wi-Fi-Funktionen: Dual band, Wi-Fi Hotspot; Wi-Fi Hotspot
USB: USB Type-C; USB Type-C
USB-Funktionen: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B3 (1800), B8 (900)