hisense A9 Pro vs iiif150 Action 15 Pro

Übersicht

Marke: HiSense; iiiF150
Erscheinungsdatum: März 2023, vor 3 Jahren und 4 Monaten; Oktober 2025, vor 9 Monaten
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 401.000 Antutu v10 Overall performance better than 65% of devices

Größe: 6.1"; 6.78"
Auflösung: 824 x 1648 px FHD; 1080 x 2400 px FHD+
Typ: eInk E INK Carta 1200; AMOLED
Pixeldichte: 302 ppi High Density; 388 ppi High Density
Seitenverhältnis: 18:9; 20:9
Funktionen: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, SGS Certified, Refresh rate 120 Hz, Brightnes 500 cd/m² (typ), 2.5D curved glass screen, Dual Edge display, Capacitive, Multi-touch, Frameless, In-cell

Chipsatz: Qualcomm Snapdragon 662; MediaTek Helio G100
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x2.2GHz Cortex A76 + 6x2GHz Cortex A55
CPU-Typ: Octa-Core; Octa-Core
Fertigung: 11 nm; 6 nm
Taktfrequenz: 2 GHz; 2.2 GHz
GPU: Qualcomm Adreno 610; Arm Mali-G57 MC2
Arbeitsspeicher: 8 GB; 8 GB
64-Bit: Yes; Yes

Auflösung: 13 Mpx; 50 Mpx
Blende: Unknow; ƒ/ 1.9
Blitz: LED; LED
Optische Stabilisierung: No; No
Zeitlupe: No, 30 fps; No, 30 fps
Funktionen: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Sony IMX766
Pixelgröße: —; 1.00 µm
Sensorgröße: —; 1/1.56"

Abmessungen: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 74.6 mm 164.6 mm 6.9 mm Print 3D Model
Gewicht: 183 g; 177 g
Materialien: Plastic; Plastic
Farben: Black; Black White
Nutzbare Fläche: 76 %; 90 %
Wasser-/Staubschutz: —; IP68, IP69 , MIL-STD-810H
Sturzfestigkeit: —; Class A B C D E 270 drops without defects
Reparierbarkeit: —; Class A B C D E

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.0
Bluetooth-Profile: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi-Funktionen: Dual band, Wi-Fi Hotspot; Wi-Fi Hotspot, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB-Funktionen: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)