hisense A9 Pro vs hmd Fusion

Übersicht

Marke: HiSense; HMD
Erscheinungsdatum: März 2023, vor 3 Jahren und 4 Monaten; September 2024, vor 1 Jahren und 10 Monaten
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 456.552 Antutu v10 Overall performance better than 72% of devices

Größe: 6.1"; 6.56"
Auflösung: 824 x 1648 px FHD; 720 x 1612 px HD+
Typ: eInk E INK Carta 1200; LCD IPS
Pixeldichte: 302 ppi High Density; 269 ppi Medium Density
Seitenverhältnis: 18:9; 20:9
Funktionen: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, Refresh rate 90 Hz, Peak brightness - 600 cd/m², Brightnes 480 cd/m² (typ), Scratch resistant, 2.5D curved glass screen, Capacitive, Frameless

Chipsatz: Qualcomm Snapdragon 662; Qualcomm Snapdragon 4 Gen 2 (SM4450)
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x2.2 GHz Cortex A76 +6x 2.0 GHz Cortex A55
CPU-Typ: Octa-Core; Octa-Core
Fertigung: 11 nm; 4 nm
Taktfrequenz: 2 GHz; 2.2 GHz
GPU: Qualcomm Adreno 610; Qualcomm Adreno
Arbeitsspeicher: 8 GB; 6 GB
64-Bit: Yes; Yes
RAM-Typ: —; LPDDR4X RAM

Auflösung: 13 Mpx; 108 Mpx
Blende: Unknow; Unknow
Blitz: LED; LED
Optische Stabilisierung: No; No
Zeitlupe: No, 30 fps; Yes, 120 fps
Funktionen: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Kapazität: 256 GB; 128 GB
SD-Slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Typ: —; UFS Storage 2.2

Abmessungen: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 75.5 mm 164.2 mm 8.3 mm Print 3D Model
Gewicht: 183 g; 203 g
Materialien: Plastic; Plastic
Farben: Black; Black
Nutzbare Fläche: 76 %; 83 %
Wasser-/Staubschutz: —; IP54
Sturzfestigkeit: —; Class A B C D E 270 drops without defects
Reparierbarkeit: —; Class A B C D E

Betriebssystem: Android 12 Snow Cone Android 12; Android 14 Upside-down cake Android 14
Google-Dienste: With Google Mobile Services; With Google Mobile Services
Updates: —; OS updates: 5 years

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM / eSIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.1 LELow energy consumption
Bluetooth-Profile: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy), APT-x, Apt-x Adaptive
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi-Funktionen: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB-Funktionen: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B32 (1500), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)
5G: —; n1 (2100), n3 (1800), n5 (850), n7 (2600), n8 (900), n20 (800), n26 (850), n28b (700), n28a (700), n38 (2600), n40 (2300), n41 (2500), n77 (3700), n78 (3500)