hisense A9 Pro vs hotwav T7S

Přehled

Značka: HiSense; Hotwav
Datum vydání: březen 2023, před 3 lety 4 měsíci; leden 2025, před 1 lety 6 měsíci
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Velikost: 6.1"; 6.52"
Rozlišení: 824 x 1648 px FHD; 1080 x 2460 px FHD+
Typ: eInk E INK Carta 1200; LCD IPS
Hustota: 302 ppi High Density; 407 ppi Very high density
Poměr stran: 18:9; 21:9
Funkce: Water Drop Notch, Capacitive, Multi-touch, Frameless; Water Drop Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Dragontrail glass, Capacitive, Multi-touch

Čipset: Qualcomm Snapdragon 662; MediaTek MT8788V
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
Typ CPU: Octa-Core; Octa-Core
Výrobní proces: 11 nm; 12 nm
Frekvence: 2 GHz; 2 GHz
GPU: Qualcomm Adreno 610; Mali-G72 MP3
RAM: 8 GB; 4 GB
64bitový: Yes; Yes
Typ RAM: —; LPDDR4X RAM

Rozlišení: 13 Mpx; 21 Mpx
Clona: Unknow; Unknow
Blesk: LED; LED
Optická stabilizace: No; No
Zpomalený záběr: No, 30 fps; No, 30 fps
Funkce: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Senzor: —; Sony Exmor

Kapacita: 256 GB; 128 GB
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Typ: —; eMMC 5.1 Storage

Rozměry: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Hmotnost: 183 g; 310 g
Materiály: Plastic; Rugged Smartphone, Plastic , Faux leather
Barvy: Black; Black Green
Využitelná plocha: 76 %; 71 %
Odolnost vůči vodě/prachu: —; IP68, IP69 , MIL-STD-810H
Odolnost proti pádu: —; Class A B C D E 270 drops without defects
Opravitelnost: —; Class A B C D E

Operační systém: Android 12 Snow Cone Android 12; Android 13 Tiramisu Android 13
Služby Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.0 LELow energy consumption
Profily Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funkce Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Funkce USB: Charging, OTG; Charging, OTG
Navigace: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)