hisense A9 Pro مقابل hotwav T7S

نظرة سريعة

الماركة: HiSense; Hotwav
تاريخ الإصدار: مارس 2023, منذ 3 سنوات و4 أشهر; يناير 2025, منذ 1 سنوات و6 أشهر
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

الحجم: 6.1"; 6.52"
الدقة: 824 x 1648 px FHD; 1080 x 2460 px FHD+
النوع: eInk E INK Carta 1200; LCD IPS
الكثافة: 302 ppi High Density; 407 ppi Very high density
نسبة العرض إلى الارتفاع: 18:9; 21:9
الميزات: Water Drop Notch, Capacitive, Multi-touch, Frameless; Water Drop Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Dragontrail glass, Capacitive, Multi-touch

المعالج: Qualcomm Snapdragon 662; MediaTek MT8788V
وحدة المعالجة المركزية: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
نوع المعالج: Octa-Core; Octa-Core
تقنية التصنيع: 11 nm; 12 nm
التردد: 2 GHz; 2 GHz
معالج الرسوميات: Qualcomm Adreno 610; Mali-G72 MP3
الذاكرة العشوائية: 8 GB; 4 GB
64-بت: Yes; Yes
نوع الذاكرة العشوائية: —; LPDDR4X RAM

الدقة: 13 Mpx; 21 Mpx
فتحة العدسة: Unknow; Unknow
الفلاش: LED; LED
التثبيت البصري: No; No
التصوير البطيء: No, 30 fps; No, 30 fps
الميزات: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
المستشعر: —; Sony Exmor

السعة: 256 GB; 128 GB
فتحة SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
النوع: —; eMMC 5.1 Storage

الأبعاد: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
الوزن: 183 g; 310 g
المواد: Plastic; Rugged Smartphone, Plastic , Faux leather
الألوان: Black; Black Green
السطح القابل للاستخدام: 76 %; 71 %
مقاومة الماء والغبار: —; IP68, IP69 , MIL-STD-810H
مقاومة السقوط: —; Class A B C D E 270 drops without defects
قابلية الإصلاح: —; Class A B C D E

نظام التشغيل: Android 12 Snow Cone Android 12; Android 13 Tiramisu Android 13
خدمات Google: With Google Mobile Services; With Google Mobile Services

بطاقة SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
بلوتوث: Bluetooth 5.1; Bluetooth 5.0 LELow energy consumption
ملفات تعريف البلوتوث: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
ميزات Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
ميزات USB: Charging, OTG; Charging, OTG
الملاحة: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)